Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Wed Jul 31 06:50:10 EDT 2002 | mzaboogie
We have recently implemented a selective solder process using no clean flux. We have experienced a problem with "micro solder balls" Some of them are not so "micro". The equipment manufacturer stated that this is a common problem with no clean select
Electronics Forum | Fri Aug 16 09:02:47 EDT 2002 | ksfacinelli
Thanks guys......
Electronics Forum | Tue Sep 24 11:10:07 EDT 2002 | Gregg Temkin
I�d appreciate assistance in trying to resolve a placement/soldering problem. My company has designed a board which uses a large number of 0402 LED�s that are .028� high. The LED�s need to be soldered so that they point straight up and are not til
Electronics Forum | Thu Oct 10 21:41:38 EDT 2002 | surachai
No need to change solder pot ,anyway the contamination during clean and no clean flux may happen when change from clean to no clean which it will float on the surface of solder pot , you only clean it ( same as the dross removal ) due to in the norm
Electronics Forum | Thu Oct 17 21:32:28 EDT 2002 | davef
Please help to clairify the problem. Are we talking: * A pre-reflow [placement] problem? * A post-reflow [solder wetting] problem? Is the wetting issue that you mention related to the board or to the component? Please give us a little more detail
Electronics Forum | Fri Oct 25 03:46:37 EDT 2002 | Adam
GUYS HOW SAFE IS IT TO USE RMA FLUX WHICH IS DESIGNED FOR WAVE SOLDERING, TO USE FOR TOUCH-UP/REWORK ? CURRENTLY ALL OUR OPERATORS HAVE LITTLE RE-FILLABLE BOTTLES AND GO AND FILL THEM UP FROM THE FLUX CONTAINERS ( I'M NOT EVEN TOO SURE WHETHER OR NO
Electronics Forum | Wed Nov 06 17:50:46 EST 2002 | davef
I hear you on the profiling issue. That won't get at the issue any how. Your observation of solder wetting confirms that solderability is NOT the issue. You may be seeing a "cold solder connection". The issue is the TCE of the different materia
Electronics Forum | Tue Nov 19 10:25:45 EST 2002 | mcmilse
I have a question abut flux and solder preforms. We build some assemblies that have deep pockets in which we use solder preforms and add flux before placing parts and then onto reflow. I was wondering if anyone knows anything about how much flux sh
