Electronics Forum | Tue Dec 12 07:01:45 EST 2000 | Chris Betlejewski
Does anybody know how often you should scrape the dross off the solder pot? What happens if too much dross is left? How often should the solder pot be cleaned?
Electronics Forum | Fri Dec 08 19:08:52 EST 2000 | Mike Konrad
I do not know which specific flux you are using, but here are some general guidelines. If your wave soldering machine uses a foam fluxer, then there are foaming agents in the flux. Under �normal� conditions, the volatiles (including the foaming age
Electronics Forum | Fri Dec 01 08:48:45 EST 2000 | Michell Sanchez
Hello everyone, thank you for taking the time to read this. I am currently looking for 40 solders to work in south Florida. If anyone has any friends or family that would be interested please E-Mail me @ msanchez@Onsite-inc.com. Thank you in advance
Electronics Forum | Thu Nov 30 22:47:54 EST 2000 | CAL
Contact Lee Whiteman @ ACI/empf. Lee is an industry expert in Leadfree soldering. He has also ran an IPC leadfree work shop involving a DOE on Leadfree Screen Printing. Lee can be reached at lwhiteman@aci-corp.org or 610-362-1200. Best regards, Cal
Electronics Forum | Thu Nov 30 21:06:02 EST 2000 | Dave F
Tell me where I can learn more about vacuum casting and its application to solder paste, please.
Electronics Forum | Tue Nov 14 21:55:54 EST 2000 | Dave F
There's a boat load of causes for icicles. Favorites are: * Conveyor speed too high * Conveyor angle too high * Contaminated solder
Electronics Forum | Tue Nov 14 22:01:07 EST 2000 | Dave F
I'd love to get to the point that I could discuss the impact of flux on dross formation. Until then, I fight with proper solder pot temperature, maintaining enough pump speed, and solder contaminants.
Electronics Forum | Wed Nov 08 06:52:23 EST 2000 | Cristiano Dick Smiderle
I looking for a possible rework on component terminals that are not soldering in a wave solder machine. The terminals (leads) are very oxidated.
Electronics Forum | Sat Oct 28 10:24:56 EDT 2000 | Ben
Try to insert thin copper plate (approx. 1.5mm thk) at the end of the flow direction. Place it approx. 2mm away from the lead. The copper will pull away the solder & thus minimise bridging problem.
Electronics Forum | Mon Oct 23 21:01:18 EDT 2000 | Dave F
Don't overlook the SMTnet Archives there is quite a bit of experience there from people slopping solder on their gold fingers.
