Electronics Forum | Thu Jul 07 18:03:27 EDT 2005 | russ
Sarag, FYI tombstoning is a functional failure. Tombstoning is where one end of the component is not soldered and is in the air above the board/solderjoint surface. You may be thinking of billboarding (part on its side with both ends soldered down)
Electronics Forum | Thu Jul 07 05:12:08 EDT 2005 | bbudianu
Hi. I'm new in bussines. I have a DEK screen printer and I have to choise solder paste and flux. It has to be lead-free. What do you recomand? Of course it has to be cheap and good. :)
Electronics Forum | Thu Jul 07 13:30:09 EDT 2005 | alandra516
Yes there are other solutions. Call me at 903-892-5636 to discuss. Glenn
Electronics Forum | Fri Jul 08 10:12:55 EDT 2005 | davef
Speeedline paper [ http://www.speedlinetech.com/docs/Equipment-Lead-Free-Wavesoldering.pdf ] discusses this in public.
Electronics Forum | Thu Jul 14 01:43:09 EDT 2005 | pyramus
Solder paste used was Kester FL250M (no-clean).... components affected were only chip components 0603, no BGA & no IC components.
Electronics Forum | Fri Jul 15 16:27:55 EDT 2005 | davef
It depends on how much paste you put on the pads. Assuming your stencil is 1:1 to the pad and the solderability protection on the board is something other than HASL, we'd guess that your solder height is approximately 50% of your stencil thickness,
Electronics Forum | Tue Aug 15 17:00:52 EDT 2006 | Board House
Bake your solder mask and then solder coat. If you are going to put an immersion finish like Osp, gold, tin or silver you would have to do a Micro etch to clean the copper prior to placing the surface finish. Regards, Board House
Electronics Forum | Fri Jul 22 03:07:45 EDT 2005 | Joseph
Dear all, As we know there is a high risk of reliability issue due to lead contamination during mixture of NLF component at LF wave soldering process. But we have the following feed back from one of our customer as follow: Concerning the risk of m
Electronics Forum | Mon Jul 25 17:24:25 EDT 2005 | Kris
0.2% lead will make your solder non compliant with RoHS when you move to a completely RoHS compliant BOM. Check with your bar vendor how much it will take to convert a pot containing 0.2% lead to
Electronics Forum | Wed Aug 10 10:41:23 EDT 2005 | patrickbruneel
Bob, Great theory if you're selling SN100C, but I have to disagree that an alloy being 4�C off eutectic will cause cracks. When a solder joint exits the solder wave, there is an immediate drop in temperature of 100�C. so being off 4�C is irrelevant.