Electronics Forum: solderers (Page 441 of 2099)

Question of which bread pan to use when draining the wave solder pot?

Electronics Forum | Wed Oct 07 13:30:57 EDT 2020 | davef

I have great memories [bad dreams??] of draining solder pots. Previous discussions on SMTnet are worthy of review. Some are here: https://smtnet.com/index.cfm?fuseaction=search_submit&searchstring=bread+pan&collection=site_forum

PB-FREE wave solder machine

Electronics Forum | Tue Nov 03 18:56:22 EST 2020 | goldendragon

All, I'd like to know what a good used wave pb-free solder machine out there? Appreciates!

Soldering lead free and leaded tin in the mix in one machine

Electronics Forum | Thu Dec 17 18:24:37 EST 2020 | SMTA-64387520

We use both in our selective soldering machine. Training is the most important concern. As long as you have well trained operators the risk is minimized.

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Fri Dec 11 08:56:08 EST 2020 | SMTA-64304223

One of the common causes of solder ballin is also outgassing from the boards have your tested the board for outgassing? Bob Willis

FLEXI-TERM Components

Electronics Forum | Tue Jan 19 10:23:23 EST 2021 | grahamcooper22

Do any assemblers use AVX FLEXITERM components ? Anyone experience any instances where the devices look to have soldered well, but then when handling the pcbs, and maybe with a little bit of pcb flex..the CHIPS just drop/pop out the solder fillets ?

Solder mask vs non solder mask defined pads

Electronics Forum | Fri Jan 22 16:03:17 EST 2021 | SMTA-64387124

Does anyone see any issues in mixing SMD and NSMD pads within one BGA footprint. We have high current pads which we want to make SMD and the other signal pads to be NSMD

Solder Ball on PCB pad after printing (DEK)

Electronics Forum | Tue Apr 27 18:43:29 EDT 2021 | reem1993

Hi, I encounter the phenomenon of Solder Ball on pads after printing useing DEK, is someone encounter the same problem? How may i fix it? best regards,

Au Thickness in ENIG PCB

Electronics Forum | Wed May 05 15:31:14 EDT 2021 | edhare

0.5 to 1 micron is typically too thick and can result in gold embrittlement of the solder joint. Typical IG thickness is 0.18 microns. see https://www.semlab.com/papers/gold-embrittlement-of-solder-joints/ Ed Hare

How Solder paste Volume/Area is calculated for my product.

Electronics Forum | Sat May 29 06:07:16 EDT 2021 | rsatmech

Thanks, I do observed more solder paste terms of percentage in 0.06mm stencil than in 0.08mm stencil.

solder pot analysis

Electronics Forum | Thu Jul 22 16:53:00 EDT 2021 | proceng1

Are you analyzing the solder in-house, or sending it to a lab? Our lab report gives the acceptable range, and our measured value.


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