Electronics Forum | Mon Nov 24 10:41:29 EST 2003 | ilona
Hi, there is also a German company making odd-shaped component insertion equipment, actually very very suitable for LED placement and soldering in the same process cycle. LED's are held in position until soldering is complete, straight and in the s
Electronics Forum | Mon Dec 22 15:35:18 EST 2003 | davef
Marc: Please be more explicit. * When you say, "parts have a metal shell"; are you talking about the component leads or the component body? What is the metal, what is it appearance, and what are it's implications? * When you say, "the parts have a
Electronics Forum | Tue Jan 06 15:57:30 EST 2004 | dbdavis
Dear Colleagues, I am evaluating the Linear Tech. Corp. LTC1733 MSE Package for use in our SMT Dept.. For this application I will need to consider the possibility that we will be required to repair these devices after some time in the field. My probl
Electronics Forum | Thu Jan 15 09:40:47 EST 2004 | davef
Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24429 Do not get your hopes up about finding something to support your "leaching out of silver theory", though. * AgxSn IMC are disbursed ro
Electronics Forum | Fri Jan 16 14:24:11 EST 2004 | dwoodrow
We would like to start testing our lead free wave solder machines in house. Mostly looking for lead and copper content. Malcom makes a relatively inexpensive machine that does this (STA-1 http://www.malcomtech.com/products_sta1.html). Does anyone
Electronics Forum | Wed Mar 17 19:41:15 EST 2004 | Dreamsniper
I'm hit with the above problem and found out that the BGA's themselves have fibres on their solder balls. I have soldered some without having the knowledge of the above fibres and found that the fibres are caught between the PCB pad and the BGA solde
Electronics Forum | Wed Mar 24 15:08:08 EST 2004 | John
I'm working on a new product soldering to a thick film material. We currently use only No Clean solder pastes. The vendor that supplies the substrate has suggested going to an RMA paste to improve solderability. We haven't used any, but I'm not fa
Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
Electronics Forum | Sun Apr 11 20:03:46 EDT 2004 | Tom B.
You should add a Capacitor Discharge statement in ICT test Software. This could be done by selecting the nodes and have statements to connect relays to ground. Could be possible that the Selective Soldering system is the cause, as problems is now s
Electronics Forum | Wed Apr 14 20:24:48 EDT 2004 | Ken
What do you mean the solder must "survive" 260C? What is your target temperature? Is it dictated by a component, the substrate or the solder alloy? Do you require a eutectic alloy? If not, the selection of alloys grows. (these are from memory...n
