Electronics Forum | Mon Dec 29 14:47:36 EST 1997 | justin medernach
| how to determine the optimum solder paste height ? Ray, This is a gross misconception within the industry. There is no optimum solder paste height, per say. The effectiveness of a solder joint should be quantified in volume. Use your process as
Electronics Forum | Fri Apr 19 15:48:28 EDT 2002 | davef
I don�t know much about zinc either. I can tell you that zinc forms no intermetallics with lead. So, I�m not so sure that �diffusion� is the correct term. Of the following: * Hwang "Modern Solder Technology For � * Wassink "Soldering In Electronic
Electronics Forum | Sat May 18 07:36:31 EDT 2002 | davef
Copper teminations with no solderability protection on your LLP. Hmmm seems unusual, but it could be that the flux in your solder paste is not active enough to remove the corrosion on the Cu leads. OMG Microbond solder paste develops white residue
Electronics Forum | Tue Jun 04 17:05:52 EDT 2002 | davef
Solder balls floating around on the air currents of a reflow oven. I sincerely doubt it. Could the solder on your gold fingers be from: * Excess placement force during P&P? * Ejactula from solder deposits during rapid preheat ramp rates? * Ejactula
Electronics Forum | Wed Jun 26 11:13:09 EDT 2002 | robbied
Can anyone help? Our Solder bar suppier is discontinuing the Sn63 Pb37 solder that they currently supply us. Another company has offered us a 'direct replacement' which is their own Sn63 Pb37 solder bar. The only problem I have with this is that the
Electronics Forum | Tue Dec 17 08:38:30 EST 2002 | Randy Villeneuve
Jim, In most cases if you can eliminate a process you will save money. With that in mind, an all surface mount or all through hole design is prefered. There are alternatives to that rule, like hybrid designs that can be pin and paste soldered. It al
Electronics Forum | Wed May 07 18:08:10 EDT 2003 | kent_peterson
Steve, I onlyworked on the soft beam for a few months. With a good operator it ran good. The biggest problem i saw was the solder would break. The operators would try adjusting and end up moving the solder point. We had two machine back to back one r
Electronics Forum | Tue Feb 03 09:36:05 EST 2004 | davef
Unfortunately, IPC-D-279, IPC-TM-650, IPC-TR-464, and MIL-STD-810 will not answer your questions, because they do NOT address LF-solders. Even the tests in IPC-9701 need to be modified for LF-solders, because: * LF-solder has different creep behavior
Electronics Forum | Mon Aug 16 16:57:06 EDT 2004 | Shean Dalton
Try to observe the board as it exits the wave, look for solder snapping as the leads finally exit the solder. The surface tension could be such that a "string" of solder stretches away from the wave until it finally breaks. Then, as the string reco
Electronics Forum | Mon Aug 09 11:34:25 EDT 2004 | Woodsmt
I am looking for data / info on how flux may contaminate the solder in a Wave. I have a customer who requires a no clean process. Our wave is equipped with 2 separate fluxing systems and I would like to use OA in one and the No Clean in the other. Th
