Electronics Forum | Thu Jun 06 11:42:24 EDT 2002 | Brad Jakeway
What you are seeing on your gold fingers is referred to as flux spattering. This is a very commond problem with gold fingers if you have a zero flux spattering criteria for quality control. The key to eliminating this problem is in the reflow profi
Electronics Forum | Thu Jun 06 14:20:14 EDT 2002 | davef
For solder paste print inspection critera, look here: http://www.ppm-monitoring.com/
Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick
Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a
Electronics Forum | Fri Jun 14 14:30:36 EDT 2002 | davef
Assuming you are talking about solderable surfaces: People specify various materials to protect the solderability of the pads on the board. Gold, actually, Electroless Nickel - Immersion Gold [ENIG], is popular. * Board fabricators like it because
Electronics Forum | Wed Jun 26 16:20:11 EDT 2002 | dason_c
Here is another one http://www.alphametals.com/products/techarticle/1999140040.pdf
Electronics Forum | Mon Jul 01 13:53:47 EDT 2002 | Sherry E. Howard
Thanks for your input!
Electronics Forum | Mon Jul 01 13:54:32 EDT 2002 | Sherry E. Howard
Thanks for your input!
Electronics Forum | Mon Jul 01 13:55:16 EDT 2002 | Sherry E. Howard
Thanks for the article locations!
Electronics Forum | Thu Jun 27 06:42:05 EDT 2002 | robbied
Thanks for the good info. Dave.
Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied
Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run
