Electronics Forum: solderers (Page 726 of 2099)

Re: BGA underside cleaning

Electronics Forum | Thu May 07 15:56:43 EDT 1998 | Terry Burnette

80ppm). The CTE of your board and solder joints will typically be 18-22ppm. We have seen cases were the coating fills the gap between the component and the board, then during temperature cycling the coating expands to the point of breaking the solder

Soldering die to heatsinks

Electronics Forum | Thu Apr 16 08:07:05 EDT 1998 | Stan

Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare die.

Re: Water Soluable Flux for Military

Electronics Forum | Fri Apr 03 08:25:11 EST 1998 | Scott Cook

| Does anyone know what the military uses for water | soluable flux in their wave solder process: | - wave flux | - rework flux | - cored solder | and approval steps to go through to qualify it. | Any information is appreciated. Thank you. Sylvia

Gold plated components - solderability issue

Electronics Forum | Mon Mar 30 03:10:44 EST 1998 | Patrick Ng

Hi, We have encountered de-wetting issues with gold plated components( SMT LEDs ). The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). The rest of the components on the boards are not having this

Re: reflowing through hole components

Electronics Forum | Tue Apr 07 05:46:15 EDT 1998 | bob willis

| we are looking for paste printing specs.& stencils holes shapes to | perform soldering reliability d.o.e. of the a.m. | subject. | looking forward to your info. | tech. dept. /telrad prod. For information on PIHR soldering there is a report, vid

used wave soldering systems

Electronics Forum | Thu Feb 26 16:49:57 EST 1998 | specnor tecnic corp

we have some rebuilt wave soldering systems in stock ready to be shipped. epk-ii smt with lambda wave, chip wave ,omega wave. 4 preheaters,jacking stand roll out computer control. machine is in a great shape. another machin upk15f with 6 preheaters

Re: Solder Printing Stencil design

Electronics Forum | Mon Feb 23 21:27:20 EST 1998 | fxb

| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |

Solder/Desolder Machines - Want recommendation for good machine.

Electronics Forum | Mon Jan 12 14:50:47 EST 1998 | Dave A.

We are looking for a good solder/desolder machine for state-of-the-art pcb rework. A step up from the Pace/OK Industries is the level I am researching. The application is a nice R&D Lab on state-of-the art PCBs. Anybody who has suggestions or recomme

Re: Voids in micro-BGA solder joint

Electronics Forum | Sun Dec 28 05:31:59 EST 1997 | Bob Willis

We have a x ray inspection criteria video and poster set which may be of interest check out our home page www.bobwillis.co.uk | | I'd like someone gives me a tip for elemating of voids | | in the mico BGA solder joint and the method of inspection |

Re: Solder Paste Stencil specifications

Electronics Forum | Wed Dec 31 23:11:07 EST 1997 | Scott McKee

| I require a Template for an internal | Solder Paste Stencil Specification. | If any one has ANYTHING, could you please reply. | Graham My suggestion would be to contact your stencil manufacturers. They've seen it all and know more than most... Ask


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