Electronics Forum | Fri Oct 01 16:12:00 EDT 2004 | palmerg
As long as they're good. Have you guys had any free "help" from so called engineers that turned into a costly waste of time (both in resources and line down). I have heard some real horror stories from former co-workers. I haven't heard this about th
Electronics Forum | Tue Oct 05 08:05:42 EDT 2004 | Grant
Hi, Has anyone had any experience with lead free Sn-8Zn-3Bi solder paste? Apparently in Japan it's becoming popular because it's got a melting point of below +200C. Can anyone confirm that, or does anyone have experience with it? Regards, Grant
Electronics Forum | Wed Oct 20 06:23:54 EDT 2004 | C Lampron
Hi Matt, Sounds like the HASL may be to thin on some pads and you're getting copper migration. If this is the case, and the solder paste is printing, I would asume you would see some solder balls under the BGA at X-Ray or incosistancies in ball size
Electronics Forum | Tue Oct 19 10:10:39 EDT 2004 | Claudine Y. Corda
My company now sells the EVS solder recovery system. Yes, there are companies reclaiming lead-free. Hopefully an actual user will respond to your post but you can feel free to email me if you want me to put you in touch with an end-user. cycorda
Electronics Forum | Thu Oct 21 17:05:11 EDT 2004 | davef
While it's not exactly what you asked, it's similar. Here is a thread from the fine SMTnet Archives from a couple of weeks ago, where we spoke about the topic of mixed lead-free solder with components that have lead-bearing solderability protection:
Electronics Forum | Sun Oct 31 09:19:26 EST 2004 | Steve
I believe on High Temp. Spheres you require paste eutectic 63/37. The solder paste forms an intermettalic bond to the pad and a bond to the surface structure of the high temp sphere. The standard 63/37 alloy spheres will melt during reflow and form t
Electronics Forum | Mon Nov 08 15:10:52 EST 2004 | russ
We usually get some mask material from our board house. It cures with heat so it works really well in our applications. Be wary of the "overcoat pens" they don't seem to hold up under heat and thre solder will flow right underneath it during BGA a
Electronics Forum | Tue Nov 23 08:49:08 EST 2004 | zanolli
Please contact me offline and I can discuss methods of attaching solder balls to stamped metals contacts �on the fly� while the contacts are still continuously oriented or in reel form. Regards Jim Zanolli Teka Interconnection Systems Phone: 401-785
Electronics Forum | Fri Nov 19 16:38:15 EST 2004 | grayman
Hi, We only use alcohol for cleaning stencil but it gives us best result even with no clean solder paste. We are using Branson.Furthermore, we have fine pitch components.Try cleaning the tank maybe there are solder accomolation in the tank or try in
Electronics Forum | Mon Dec 06 12:27:01 EST 2004 | Scott B
We are currently reviewing a design which has a leadless chip scale package with a solder thermal pad on the underside. The application notes for the device specify use of a no-clean solder paste as the gap under the device will prevent cleaning. Is
