Electronics Forum | Fri May 20 09:45:57 EDT 2005 | young
Hello, I was wondering if anyone knows where I could get a solder pot exhaust fan? Here are the specifications: Manufacturer: Emerson Description: Belted Fan + Blower Duty Model: S63CXJDJ-7165 CAT: 5795C HP: 3/4 RPM: 1725/1140 Voltage: 115 Hz: 60
Electronics Forum | Tue May 24 10:52:12 EDT 2005 | stepheniii
How big are the boards? I havn't done a lot with wave solder and I'm just wondering, how much solder these boards would use. Also I seem to recall being told that a thin layer of dross helps prevent more dross from forming. Of course this would not b
Electronics Forum | Wed May 25 17:29:58 EDT 2005 | Peter
We are evaluating a low halide Water soldering flux (Aim WS716). Has anyone had good/bad experience with it? Our operator has mentioned strong and irrating smell, even when standing a foot away from the conveyor entry/exit. The fluxer is embedded w
Electronics Forum | Tue May 31 10:44:16 EDT 2005 | Scott B
We have found that when the HASL thickness is less than 5 microns the tin in the HASL reacts with the copper leaving a SnCu surface with poor solderability and microscopic grainy Pb islands. The IPC does not specify minimum HASL thickness but we now
Electronics Forum | Mon Jun 13 09:23:54 EDT 2005 | russ
I agree with Dave on the Water soluble process for this part. It is interesting that I have yet to find a Water Soluble for lead free that works. I have experienced a lot of problems with the flux on these pastes, wetting, solder balls, etc... kind
Electronics Forum | Wed Jun 22 15:03:12 EDT 2005 | patrickbruneel
The only thing ammonia can do is tarnish copper and make it more difficult to solder. And the higher temp in lead-free will discolor the latex (giving it a sticky surface), but the functionality of the mask will be intact. There should be greater co
Electronics Forum | Mon Jun 27 09:38:30 EDT 2005 | Bob R.
What problems are the quality people seeing? I hope they aren't expecting a toe fillet. QFNs are typically cut from an array after plating. This leaves exposed copper on the sides of the part. We'll often see smearing from the sawing process that
Electronics Forum | Fri Jul 15 13:58:32 EDT 2005 | seaK
Our production is putting QFN40 and QFN56 package on board. With 80% opening on terminal, 40% on thermal pad, we found QFN56 100% forming toe fillet, but it does not work out the same to QFN40. We suspect it's because of the weight of component.....
Electronics Forum | Tue Jun 28 13:04:08 EDT 2005 | slthomas
Are you saying that increasing the frequency of cleaning to every 3 boards *reduced* bridging, or that it's just something you tried? I don't understand why that would help(in my experience it has reduced "insufficient solder" conditions but not brid
Electronics Forum | Tue Jun 28 11:31:23 EDT 2005 | kennyg
Anyone know of a maximum solder overprint formula? I need to overprint a 0.011" wide aperture but want to go out to 0.050" overprint. This seems extreme, but necessary as I can't go out in width due to numerous issues. It seems like one could come
