Electronics Forum | Sun May 05 17:27:32 EDT 2013 | davef
Here’s a Tweet that I made here [http://blogs.smtnet.com/smt/smt-placement/ipc-apex-2013-my-tweets/ ] … Hisco’s computer controlled frig for managing solder paste inventory … way more sophisticated than that old white frig. Davef I receive no benefi
Electronics Forum | Tue May 14 21:59:25 EDT 2013 | davef
SAC is a lead free solder alloy. At one time, Nippon Micrometal Corp. (NMC) [158-1, Sayamagahara, Iruma, 358-0032, Japan; +81.4.2934.6101 F+81.4.2934.5454 nmc-net.co.jp] called some of its alloys: LF35, LF45(SAC305), LF38(SAC105) and LF31(SAC405).
Electronics Forum | Fri May 17 10:08:47 EDT 2013 | shrikant_borkar
HI, We are facing problem of Dry solder due to QFN Grounding Solder not Drain out in Via hole. also No drain hole on PCBs now we have 15k stock. which is leading to massive Rework. We have Tried by minimizing Ground Square apertures. but no Improvem
Electronics Forum | Thu May 23 07:50:04 EDT 2013 | icin
The attached images appear to be a result of a touchup process. We believe that this is not a fracture, but more of a condition where the solder touchup process did not completely flow the solder. Is this acceptable per J-STD-001 and IPC-A-610 Class
Electronics Forum | Tue May 28 08:32:41 EDT 2013 | emeto
Hi Eric, your problem looks like a printing issue - if the part(or group of leads) missing solder is always the same. I would say you should check: 1. Stencil for any damage at this area 2. Squegee for damages 3. Adequate pin support un der the boa
Electronics Forum | Tue Jun 04 14:11:25 EDT 2013 | ericrr
So there is no articles on different solder paste then By the way I have never seen one newsletter from SMTNET, apparently they end up in the spam folder and I am not looking in there otherwise I may as well have all my email going straight into th
Electronics Forum | Thu Jun 13 12:28:41 EDT 2013 | kahrpr
18000 psi is what a injection molding machine can produce depending on the size of machine. When doing over-molding/insert molding the machines are a lot smaller less than 1000 psi and a lot of smaller items less than 500 psi. as far as Temperature 3
Electronics Forum | Thu Jun 27 23:49:40 EDT 2013 | cedric77
I had a solder paste SAC305 T4, with flux loading of 11.5%. After retrieivng out from fridge(5deg) after 48hrs, the paste turn dry (like dry mud? and after double checking the flux loading it becomes 12.5%. Has anyone ever experience this or any opi
Electronics Forum | Mon Jul 01 08:33:55 EDT 2013 | markhoch
A couple things to look at.. Are you using Pb-Free solder? What are the leads of the SD Connector tinned with? Do you have a thermal profiler to use to verify your oven profile? (If not, you may be able to ask a Sales Rep to come in and assist y
Electronics Forum | Mon Jul 08 14:52:40 EDT 2013 | hegemon
The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via. The solder mask may have been damaged or missing prior to mounting the BGA device. The larger balls at the top right are due to uneven heating during
