Electronics Forum | Tue Oct 06 15:01:33 EDT 2020 | charliedci
We've used glass (pyrex, corningware) bread pans in the past, not filling them much over 1" deep. It takes a while but leaves solder ingots sized well to drop back in. Have not tried lead free yet, the higher temp could be an issue using same ty
Electronics Forum | Mon Oct 12 01:17:00 EDT 2020 | SMTA-64386317
Hi, I am facing high fall out of microphone low sensitivity issues. This microphone is soldering thru SMT soldering with low peak temperature profile which peak at 232 DegC to 240 DegC and have skipped X-Ray inspection but still seeing fall out espec
Electronics Forum | Thu Oct 22 22:01:33 EDT 2020 | SMTA-64386500
Hi John - send me an email (david.hillman@collins.com) and I can send you a few photos of what Mike K. was describing in terms of the solder joint surface being "etched" by the cleaning solution. The dull appearance is due to the abundance of lead o
Electronics Forum | Fri Jan 22 13:22:18 EST 2021 | davidhillman
Hi Graham - brite acid tin gets it "shiny" appearance due to codeposited organic material in the tin plating. The codeposited materials volatilize during the soldering process causing a ton of voids. Brite acid tin plating should not be used as a sol
Electronics Forum | Fri Feb 05 02:40:40 EST 2021 | victorzubashev
For components with the large pads, you can also use secondary soldering dispensing. Some printers like DEK have an option to mount a syringe with an auger valve to do dispensing after the printing step process. Obviously will not work if you have to
Electronics Forum | Wed Apr 28 06:26:15 EDT 2021 | jeremy_leaf
@Evtimov I can't use flux as the components being soldered can't cope with any contamination whatsoever. Even an ultra low solids no-clean flux will be too much. I also can't clean the boards after soldering due to any residual contamination from the
Electronics Forum | Fri Apr 16 17:20:34 EDT 2021 | astarotf
We are currently producing a project that brings a TQFP64. But some boards do not solder the component well with its ideal fillet, some are well soldered when they come out of the reflow oven, but some are not. Can the pins be sulphated? How can we c
Electronics Forum | Wed May 05 05:41:02 EDT 2021 | jineshjpr
Hi All, Need your suggestions on the below queries: 1. What will happen if the Au thickness maintained @ 0.5 to 1 micron (Where Ni Thick is within 3 to 5 microns) in 0.2mm Thickness FR4 PCB. 2. Is there any solder quality affcted during Reflow Solder
Electronics Forum | Thu May 20 15:58:36 EDT 2021 | rsatmech
My product has 2.4Mil and 3.1Mil stencil. For both the stencil my SPI specification is set as 30% to 160% How this is calculated. Can anyone enlight me. Solder Paste type 5. Minimum opening is 0.16*0.18mm in stencil.
Electronics Forum | Wed Jul 07 16:15:54 EDT 2021 | bobpan
We have an Ersa and an Ace machine. The Ersa is made for bigger volumes of boards. Programming is longer/harder and not as user friendly. If your running 100 boards or less.....the Ace is the way to go. If you need flexibility the Ace is better.
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