Electronics Forum | Wed Mar 24 15:48:33 EST 2004 | davef
KIC Thermal Profiling did a DOE [Nepcon West 1999] [you probably can find it posted on their site] on thermocouple attach. Comparing the reliability and repeatability of thermocouple attachment methods: * High temperature solder was found to be the
Electronics Forum | Fri Mar 19 07:24:29 EST 2004 | pjc
Before "Pb-Free" became an issue we were and still are using Pb-Free component lead finishes- such as on many TSOP, SSOP and QFP packages as well as caps. Components manufacturers changing the lead finish to no-Pb tend to ensure solderability with Sn
Electronics Forum | Wed Mar 24 10:04:09 EST 2004 | Marc Apell
183C, 60 +- 15 seconds). The quesiton to use a straight ramp or soak profile comes down to the product your are soldering. The key is to get the whole assembly at the same peak temp (minimized delta) and same TAL for effective formation of the so
Electronics Forum | Thu Apr 01 11:53:33 EST 2004 | russ
You may want to tack a coup[le of leads first, making sure that the component is fully seated against the PCBA. Or what we do is apply solder to the E-Pad and the lead pads and then hit it with a "heat gun" until the solder melts on the E-Pad and th
Electronics Forum | Mon Apr 12 09:09:25 EDT 2004 | russ
If they are reflowing pbfree balls to bare PCB pads they are getting that component very hot tpo melt the balls and get them to wet to the pads! I would not recommend this process at all for hightemp solder balls, for 63/37 this process is fine. As
Electronics Forum | Tue Apr 13 13:01:01 EDT 2004 | arcandspark
These voids only appear in the solder connections that have a (via in pad). The pads that do not have (via in pad) do not have any voids. Profile is 60 seconds above 183 C and peak of 218 C. The BGA is an OMAP lead free,I am using standard eutectic s
Electronics Forum | Wed Apr 14 08:15:18 EDT 2004 | arcandspark
We have tried other stencils with different size openings but this company will not allow us time or money to run any experiments to define stencil criteria and printer settings, its just run, run, run. They really dont care about post reflow yields.
Electronics Forum | Tue Apr 27 17:37:30 EDT 2004 | Ren�
We have switched over form Indium's nc-smq92 to > nc-smq92j and are experiencing a ton of solder > balls. Even if the print is dead on we still seem > to be getting them. We never seemed to have this > problem with old paste unless the print was
Electronics Forum | Tue May 04 16:43:41 EDT 2004 | russ
So the only difference between the "regular solderers" and the BGA people is trace repair? If that is it than you should put the pay in range with your PCB repair people. We do not pay any extra for BGA rework since all they do is wick pads (common
Electronics Forum | Thu Jun 03 17:43:34 EDT 2004 | g2garyg2
Hi Doug, Read your inquiry. My company PRO-MATION has some exciting technologies available for both top side and bottom side selective laser soldering. Our work cells are great for low volume / high mix environments and are capble for both Tin Lead
