Electronics Forum | Sun Dec 31 07:31:40 EST 2006 | davef
Thoughts are: * Eliminate solder spotting on gold fingers through process improvement in broard handling, printing paste control, and reflow recipe development. Search the fine SMTnet Archives for previous discussions. * Dispense or print a reflow te
Electronics Forum | Tue Jan 16 07:07:17 EST 2007 | tk380514
Answers: The component does take solder, no problem We get a full barrel fill with an empty PCB but only on one of the holes, the other hole has so much copper around it. The flux reached the top of the PCB when I tested the empty PCB. The IPC-A-610
Electronics Forum | Thu Feb 22 16:40:23 EST 2007 | mika
One of our customers that always was going for Ni/Au surface finish on RoHS PCB and our processs was adjusted for that, "whithout any problem". Recently they decided to switch to another surface finsh: PbFree HASL. What is that? Imersion tin/silver?
Electronics Forum | Thu Mar 01 22:21:06 EST 2007 | davef
From our notes ... An intense evaluation was completed in 1992 that involved testing of three board types [6 layer FR4, 6 layer ceramic copper thick film, and a 4 layer copper-invar-copper board] by the Navy Surface Warfare Center, Crane, IN. [Obvio
Electronics Forum | Wed Mar 14 07:30:14 EDT 2007 | davef
So, you toss whatever is on the stencil every 8 hours. Correct? How long has it been on the stencil? * If that particular paste has been on the stencil for 8 hours, we'd agree to toss it too. * If paste has been on the stencil for less than 8 hour
Electronics Forum | Tue Mar 27 15:18:19 EDT 2007 | jmelson
Chrisw said : We have used the older and newer style Mantis scopes and our assemblers love them as you can do rework in a very natural and comfortable seating position. It took me a while fooling around to get everything in the right place, but I c
Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip
"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on
Electronics Forum | Mon Apr 09 14:53:19 EDT 2007 | flipit
Hi, We were running with few defects with lead solder paste. The lead solder paste with stencil 0.010" X 0.020" and 0.004" thick stencil produced near defect free PCB assys. 0.010" X 0.020" (0.004" thick) lead = defect free 0.010" X 0.020" (0.005"
Electronics Forum | Tue Apr 24 09:51:18 EDT 2007 | slthomas
Patrick, firstly, I don't disagree with you on the efficacy of or lack of good science behind RoHS. It's a bad joke and our industry is the victim that got punked. I simply don't see anywhere in that document that states they've got an exemption tha
Electronics Forum | Wed Apr 25 10:45:25 EDT 2007 | slthomas
I read the request months ago with great interest. However, a request is hardly an exemption. Here's my issue with the language: "23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead fra
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