Electronics Forum: solderers (Page 971 of 2099)

Voiding in LGA (LT) soldering

Electronics Forum | Wed Sep 01 05:09:27 EDT 2010 | grahamcooper22

Dear SMT Manufacturer, I am wondering if the device could have so much moisture in it and storing it in a dry cabinet isn't going to remove it all. As a final test to see if moisture in the device is causing the voids/solder balls then I'd bake it a

BGA non wetting

Electronics Forum | Mon Sep 13 22:32:41 EDT 2010 | genesan

Hi all good morning and need advice from expertise here. One of my customer complain that they have constantly issues with one of their product and ask us to do cross section.The report show there was “no wetting to the PCB copper pad” and cause the

BGA non wetting

Electronics Forum | Mon Sep 13 22:58:49 EDT 2010 | genesan

Hi all good morning and need advice from expertise here. One of my customer complain that they have constantly issues with one of their product and ask us to do cross section.The report show there was “no wetting to the PCB copper pad” and cause the

Tin HASL finish soldering problems

Electronics Forum | Tue Sep 14 10:10:39 EDT 2010 | teamcanada

We are having an issue with a PCB supplier. Their Tin HASL layer seems to be the problem. We have triedworking with them to correct their process. What seems to have helped is lowering their temperature of the Tin dip from 540 F to 510 F.We still ha

Who has best desktop AOI ?

Electronics Forum | Thu Nov 04 10:26:47 EDT 2010 | methos1979

Solder evaluation formulas and other questions: Since the last two posters have a lot of experience with the Mirtec system I had another question for them. I would like to start a discussion of some of the techniques Mirtec AOI users are employing

Kester 2331-zx flux streaking solder mask

Electronics Forum | Tue Nov 09 20:52:34 EST 2010 | ppcbs

Yes, we have had this happen with certain solder masks over the years. Hot air gun is the best solution we can find if the oven doesn't do it. Back in the day when we had a vapor degreasor, freon based solvents would also remove the clouding. Let

Way to solve PCB warpage

Electronics Forum | Sun Dec 19 23:22:11 EST 2010 | Jacki

Hi Rem Woo, ur board is such long one,7'. Our PCB is only 2' long but 3.5kg weight b4 solder. We use wave machine to solder it and PCB was sit on the pallet. all PCB side lengths are pressed by clamps. PCB was flat just after wave, however there was

Air Moisture in Production

Electronics Forum | Wed Dec 08 09:53:23 EST 2010 | fönsi

Hello Because of the cold weather, we had some troubles with drying out of printed solder paste on the pcb's. The relative humidity in the air declined below of 20%. We have a process window of store the printed board for maximum 24 hours, but with

Conformal coating

Electronics Forum | Fri Dec 10 12:24:46 EST 2010 | davef

Causes of dewetting in conformal coating. Factors that influence dewetting usually involve non-ionic contamination such as: * Residues from board manufacture including silicone surfactants from solder resist & HASL rinse contamination * Component res

BGA REFLOW

Electronics Forum | Fri Jan 07 03:34:12 EST 2011 | rpatel28364

Hi Smarts We are having difficulty in reflowing BGA wiht ROHS process on double sided board. We have tried profiling un populated board and profile is meeting upper spec of solder paste. but our customer is saying they have to heat up BGA and board s


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