Electronics Forum | Wed Dec 20 04:43:36 EST 2006 | greg york
Any decent flux would volatise off with the heat of the wave unless absorbed into the solder mask. Test this by trying to clean in alcohol or common solvent aerosol, if it does not clean then it is probably Mineral Salts from solder mask fillers. Ano
Electronics Forum | Wed Dec 20 15:40:36 EST 2006 | slthomas
I'm no metallurgist but I don't think you're going to burn up lead with a soldering iron. That said, I would surmise that you could pull a lot of the metallization from the component terminations (very likely lead free) and the pads on the board (i
Electronics Forum | Tue Jan 16 07:59:36 EST 2007 | tk380514
we worked out that the wave soldering cassettes Duratstone material takes alomst 35 degree away from the surface of the pcb, and the speed is already too slow it should be over 1.0 - 1.8 meters a minute but its now already 82 cm a minute, in order to
Electronics Forum | Mon Jan 29 14:01:41 EST 2007 | realchunks
Well, they're all "HE"'s, which may be part of the problem (good one Dave) The customer "thinks" there may be a problem but has no actual proof. The part in question is a lug terminal. It's 0.145" by 0.175" and 0.020" thick. They couldn't "see" a
Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef
Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co
Electronics Forum | Mon Feb 12 10:03:34 EST 2007 | slthomas
"(If any element�s composition is greater then is it useful/harmful to our solder paste/assembling or not?) It certainly changes the characterstics of the compound. Why you might change it depends on how you want it to behave. Be more or less ductil
Electronics Forum | Sat Feb 10 20:08:25 EST 2007 | colormaker
I just started a design where I will be placeing smt parts on both side of PCB. 50 parts on top side ranging from 0602 to SOIC8 and 4 SOIC LED's on bottom. How can I assemble with parts on both sides ? I have P&P,stensil printer, relfow and solder w
Electronics Forum | Tue Feb 13 16:28:17 EST 2007 | rob_thomas
There are solder pastes that seem to give you less voiding. Currently we are using Kester ,water soluble paste that gives us pretty good results on BGA's up to 0.5mm pitch. Stencil design was a challenge but we are getting consistent results . Here
Electronics Forum | Wed Feb 21 09:36:10 EST 2007 | hanza
Hello, We are planning to buy a desktop AOI system and were able to experiment with a Mirtec MV-2 system. Results were pretty good, except for some types of solder inspection. I am wondering if anyone has some experience with the Mirtec MV-3 (3D 5-
Electronics Forum | Thu Mar 01 18:11:41 EST 2007 | sueph
Samir, thanks for the reply. We are wondering if this idea came dowm from a customer a long time back, or maybe from Mil Std 2000. I've never worked with Mil Std 2000, so I don't know about that. We can not find anything in Jstd or 610 about it.
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