Electronics Forum | Sat Jun 26 14:15:28 EDT 2004 | PCA
Does any one have the best recommendation for a water soluble solder paste for use with fine pitch parts and micro BGA's and immersion gold pads.
Electronics Forum | Wed Jul 07 04:58:42 EDT 2004 | rajanvx
Have you tried orbotech, they have a range of machines for different tasks. They do for Through hole, VHDM pin, 0201, solder paste and many more
Electronics Forum | Fri Jul 02 17:05:26 EDT 2004 | blnorman
Depends on your specific application. Can you handle lower reflow temps? Can your parts handle higher reflow temps? What environment will your assembled product have to endure? Lot of different factors come in to play when choosing the right allo
Electronics Forum | Fri Jul 02 11:17:09 EDT 2004 | jdumont
I agree, the flux will probably burn off before it gets to do its job. Def not a good idea....
Electronics Forum | Fri Jul 02 14:15:42 EDT 2004 | bcceng
X-RAY, X-RAY and X-RAY.. to optimize your reflow process when using BGA's you have to use your reflow profile hand to hand with your x-ray process.
Electronics Forum | Sat Jul 03 11:10:48 EDT 2004 | KEN
??? Two assemblies assembled under the same conditions with identical x-ray results can have dramatically different life expectencies. Operating environments will have a direct affect on the product ie. hunidity, temperature swing, temp. duration, v
Electronics Forum | Mon Jul 05 03:53:36 EDT 2004 | johnwnz
Hey, this is something that I've looked at and published a paper on back in 2003 at Apex, actually pert of one, the other part was lookign at how effective X-ray systems (lamanography systems) were at detecting & measuring BGA void size accuratly (co
Electronics Forum | Thu Aug 12 18:06:09 EDT 2004 | SR
May I ask what component types you are using and who the suppliers are? FYI - If the components have exceeded their shelf life, they may have oxidized too much for soldering using low activity fluxes. Thanks and best regards, SR
Electronics Forum | Thu Aug 12 20:32:44 EDT 2004 | usdigital
Indy, We use Palladium silver surface finish parts for silver epoxy attached parts only. It is our understanding that this finish is not for solder, but only silver epoxy attach. I expect that is you problem. Dave
Electronics Forum | Fri Aug 13 16:54:20 EDT 2004 | davef
If the terminations on your components are not barrier plated, you must be very careful about the amount of time you stay above liquidous. As you'd expect, longer is not better. The longer you stay at liquidous, the more of the component terminatio
BAJA Bid was founded to form an auction organization with the primary objective of providing an outstanding experience for both our buyers and sellers.
Equipment Dealer / Broker / Auctions
13227 Royal George Avenue
Odessa, FL USA
Phone: 813-992-2437
.gif)
