Electronics Forum: soldering (Page 1441 of 2099)

Re: Capability Study for Solder Printing Process

Electronics Forum | Fri Sep 22 08:04:34 EDT 2000 | K.T

I 100% agree with Wolfgang. No matter how many in line or off line inspection gadgets, zillion $ printers, and top of line stencils you use, bottom line is a properly trained machine operator who gives a rat about his/her job that makes the differenc

Re: 0603 Components

Electronics Forum | Mon Sep 11 04:23:49 EDT 2000 | Wolfgang Busko

Adam: I would say that you do have a reliability problem. - check parts for solderability - check your board finish - check your profiles - check your paste - check your processes with focus on cleanliness - do some mechanical tests, you should rath

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB

As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 21:15:46 EDT 2000 | Dave F

From the SMTnet Library try: http://www.merix.com/resourcecntr/papers/osp.doc http://www.merix.com/resourcecntr/papers/hasl_alt.doc http://www.itm-smt.com/articles.html * "Organic Solderability Preservatives" * "OSPs - Better Living Through Modern Ch

AOI for SMT as well as Thru-Hole

Electronics Forum | Tue Aug 29 07:10:14 EDT 2000 | Vinesh Gandhi

Hi All, As fas as I have read about AOI systems they all talk of being used at POst paste printing, Pre reflow or post reflow stages. Is there any AOI equipment available/being used which can do the soldering inspection of a complete PCA for SMT as

Re: Stencil Cleaner

Electronics Forum | Tue Aug 29 03:59:28 EDT 2000 | genglish

Hi Francois, I made a recommendation to this question, some one else posted it earlier this month. I have done a little research and evaluated a couple of machines on site. If you require further information regarding the one I purchased for our comp

Re: solderballs after wavesoldering

Electronics Forum | Tue Aug 22 14:02:02 EDT 2000 | JAX

Caumel, You should be able to find sufficient info in the archives. Solder Balls probably hold the majority of posts and should be easy to referance. You can find out what causes them in relation to board material, profile tempature, wave type, flu

Re: solder balling

Electronics Forum | Mon Aug 07 16:23:34 EDT 2000 | Ramon I Garcia C

Hi!!! Thanks frieds for your advising, I have a MPM UP2000, I'm going to chek the humidity control, too I'll chek the profiles again, this plant it's located close to the beach about 1/2 mile from. However if you know some table to calculate t

Re: Step Stencil

Electronics Forum | Sat Aug 05 09:19:50 EDT 2000 | JAX

Felix, 1-5: A step stencil is simply a stencil with area's of different thickness( step down's ). They are used for multi-package boards( BGA, fine-pitch, ..... ). They keep you from deciding whether or not you want the fine-pitch or the BGA devices

Re: wave solder bridges

Electronics Forum | Thu Jul 27 08:38:36 EDT 2000 | Wolfgang Busko

Hi Jason, a couple of questions: What�s the pitch? Did you change direction the board is going through the wave and what happend? How about the design abnormalities for those 4 pins, thermalreliefpads or whatever? We had problems with 2mm pitch and


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