Electronics Forum: soldering (Page 1706 of 2099)

Solder Paste Inspection System.

Electronics Forum | Tue Mar 12 10:12:51 EST 2002 | steve_arneson

Wolfgang, I agree with your training concept. The idea that you need to look very closely at what type of equipment to choose is also very important. The key point is not to eliminate any of the options available based upon one view versus another

Looking for data on hand placed production component?

Electronics Forum | Thu Mar 07 02:33:44 EST 2002 | cmay

I agree with Dave. The only reliable way is to perform a time study using a watch with decimal minutes. Setup the study using an average rated operator and time 10 component insertions (from pick up to hands off), time 10 component soldering operati

POST REFLOW BALLING

Electronics Forum | Wed Mar 13 20:40:02 EST 2002 | davef

Nice maCHEEN, mon. Please explain, �reliably dispensing�. What do you mean? How do measure? How are you sure? Etc. Just as points of reference: * What is the ratio of height to diameter of your dots? * How are you sure that you�re not stringing?

Cpk Variables Control for Paste Printing

Electronics Forum | Tue Mar 19 00:14:47 EST 2002 | ianchan

Hi Guys, Can anyone help us out here, please? We need to know what formulae (other than Length(L)xBreath(B)xheight(Z)), is used to determine what volume of paste is required for 20mils pitch leadless chip carrier (LCC28), for the paste printing pro

QFP w/ oxidized leads

Electronics Forum | Tue Mar 19 11:52:25 EST 2002 | davef

We have had Corfin recommended to us, but have never needed to use them. Also consider: * EMPF uses a ROSA process for solder rejuvenation. Check with Cal [at Manncorp, a SMTnet regular] for the scoop [chocolate, vanilla, or ROCKY ROCOCO] on EMPF.

Thousands of TSOP or VSOP To be replaced after assembly

Electronics Forum | Tue Mar 19 10:27:06 EST 2002 | amir

in regards to repairing all these boards, do they consider the end cost of the product whether it's worth it to do so or not? if it does, would you be able to do it in house? and how labor intense is the job? there are machines out there for mass rep

Thousands of TSOP or VSOP To be replaced after assembly

Electronics Forum | Wed Mar 20 11:14:15 EST 2002 | cfraser

Guy's I am sorry but your dike removal process for chip components is midievil at best. The fastest way to remove a chip is with 2 solder irons. Place one iron on each end of the component. This process is completely safe and takes about 2 seconds pe

stencil printing parameters

Electronics Forum | Wed Mar 27 10:32:29 EST 2002 | barryg

hello evryone. I am rleatively new to smt production. Though we have been successfully running pcb assy's and getting very good solder quality we are trying to get some proccess control parameters set up for our printing process. We have a semiauto s

What is too much silver in a joint

Electronics Forum | Sun Mar 31 10:03:25 EST 2002 | Bob

Cheers Dave, to answer some of your questions. � The component lead is copper with a tin / lead coating. The pads are standard Copper / Nickel / Gold. � The solder is standard Tin / Lead / Silver (2%) We have a lab that can determine the composition

Selective wave selection

Electronics Forum | Mon Apr 08 22:12:26 EDT 2002 | alex_kirichenko

Hi!! I've looked at few of those. Look very nice and neat, can place and solder vurtually any shape and size.... BUT you need feeders for parts.. and they are not cheap.. I think if you have just a few desighs you can try to justify it, but if yo


soldering searches for Companies, Equipment, Machines, Suppliers & Information

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