Electronics Forum | Thu Jul 03 18:14:03 EDT 2003 | russ
Kris, I don't know what I HAVEN'T SEEN yet cuz I haven't seen it. (HAHAHA) It is kind of like when you are looking for something and you always say after you found it that it was the last place you looked (Why would anyone keep looking for something
Electronics Forum | Sat Jul 05 07:30:04 EDT 2003 | AlCapone
If the problem as you described as the gold plating contaminated, and the Nickel layer exposed to the solder pot. However, the purpose of the gold layer is to protect the nickel and copper layer not turn into corrosion and resist to other issue (humi
Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc
Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with
Electronics Forum | Wed Jul 09 18:02:48 EDT 2003 | slthomas
Just when you think you're getting somewhere... QA sent me a vendor response to our corrective action request. They stated that their normal process for this product includes an ultrasonic cleaning cycle of 20 MINUTES minimum. It might be 30, we'r
Electronics Forum | Mon Jul 14 16:26:58 EDT 2003 | slthomas
Yes, they do the cleaning, we did the (apparently first) inspection and caught the problems. They tried a shorter cleaning cycle, witnessed no defects, and attributed the defects on the boards we had to their cleaning process. Now they just plan on
Electronics Forum | Tue Jul 15 11:18:29 EDT 2003 | slthomas
It is an interesting situation....one that merits as much business philosophy analysis as technical analysis. I'll be getting my official 60 day notice today. Any criticism about our overseas suppliers (that were selected by sr. management w/o in
Electronics Forum | Wed Jul 23 08:37:02 EDT 2003 | davef
Your fabricator should be able to re-apply the imm tin very easily. Actually, if we had boards like you describe [and we were sure we didn't mess them up], we'd be be making strong implications that our fab would need to make this right. Don't pin
Electronics Forum | Tue Jul 29 09:47:40 EDT 2003 | davef
We agree with Russ and Ioan that rework does not cause black pad. It's caused during the board fabrication process. On the other hand, we think: * Mantis wants to reduce the amount of reworking of boards that fail due to a black pad problem. *
Electronics Forum | Wed Jul 30 22:37:15 EDT 2003 | Dean
I have been using a srt-1000 since 98. My guess is your heating up the part too fast. What is your heating rate (deg. C per second)? PBGA's do warp. Your profile should mimic your smt process (assuming you have no warping there). Also, check wit
Electronics Forum | Tue Aug 05 12:05:15 EDT 2003 | mleber
Through hole question - what methods can be used to obtain upflow on multi layer pwbs with huge ground planes. We are using a water soluble flux with a max temp of 220 topside. I am pushing the limits of the flux and hitting 250 topside in an attempt
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