Electronics Forum: soldering (Page 1746 of 2099)

Fine Pitch Stencil Design

Electronics Forum | Wed Dec 14 08:06:07 EST 2005 | tk380514

Also we have just made a prototype for Wave soldered SMT components D-packs + 0603 + TSSOP�s on the bottom side with THT comp. on the top, the stencil manufacturer gave his personal library of glue stencil openings and adviced on stencil thickness wh

Mis-align Component

Electronics Forum | Thu Dec 08 11:50:40 EST 2005 | Stefan

If you mention mis-alignment and missing component in the same sentance, I suspect the component is not properly released after placement. Assuming the Juki machines use an air blow, after vacuum shut off, than I would look at a correct air flow firs

Propensity of Immersion Tin surface finish fo whiskers

Electronics Forum | Mon Dec 12 09:39:39 EST 2005 | Amol Kane

thank you devef....My point is this....If you solder all the areas that have Imm Sn on them, there wont be any whisker formation DUE TO THE IMM TIN COATING.....whiskers could still potentially form as a result of COMPONENT FINISHES and effective miti

Mechanical strenght

Electronics Forum | Thu Dec 08 22:15:46 EST 2005 | molosse21

Hi everyone, One of our customer is asking us wich one of these two components has a better resistance to vibration. Vibration can be a potential problem for them. He has the choice between a thru hole radial capacitor with near 0.400 in diameter an

X7R woes

Electronics Forum | Mon Dec 26 10:45:40 EST 2005 | davef

+85*C. * Wave solder preheats are >100*C just prior to entering the wave * Temperature changes between exiting the chip wave and the laminar wave can swing through >100*C * Do not exceed 3*C per second maximum rate of change in temperature. Generall

X7R woes

Electronics Forum | Mon Dec 26 13:24:12 EST 2005 | mariss

I'm assuming the fracture in tension; the fracture doesn't show even at X50. The broken edges are that clean. I would expect spalling at the fracture edges if it were a compression or torsional fracture. This makes me belive the board expands and pul

Separate Oven for lead-free reflow

Electronics Forum | Wed Jan 04 13:59:14 EST 2006 | chunks

Ask your customer why they need this? Show them your process. Then bury them in their own unknowledgeable requests. It is pretty scary how many papers are also written about how easy it is to reflow a lead-free BGA with regular leaded paste. ht

AMD L60 pick&place

Electronics Forum | Mon Jan 09 07:01:47 EST 2006 | ron

I was wondering if anyone was using this machine to place 0402's and what type of 1st pass yield you were getting. I'm a little leary about the mechanical centering on such small parts. How is the feeder pick up position after it is taught? I have h

Solder Paste Evaluation

Electronics Forum | Thu Jan 12 12:35:14 EST 2006 | slthomas

Phil's a cool guy. I had a few email exchanges with him when I registered for his site a few years ago. I told him up front that my company at the time wasn't planning on spending any money for services and that I was only digging for information.

Solder Paste Evaluation

Electronics Forum | Thu Jan 12 13:58:13 EST 2006 | sarar

I agree. Phil is a very respectable guy who knows what he's talking about, and his writings are well-done. I'm sure there are some consultants out there who are less than par, and the profession as a whole has a stigma of just rambling a bunch of m


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