Electronics Forum: soldering (Page 1841 of 2099)

Re: Double sided reflow

Electronics Forum | Wed Feb 18 12:08:04 EST 1998 | Eyal Epstein

Hi, I am from Celtronix Ltd. we are a provider of Odd Form assembly equipment and have gained a lot of experience in double side reflow, both the chemical side of it as well as the automatic insertion of all types of TH components in paste. Enclosed

Re: Solder Paste

Electronics Forum | Wed Jan 28 19:39:08 EST 1998 | Steve Gregory

| | What is the lifetime for a typical solder paste ? | | How long can boards be stacked waiting before the paste goes off ? | Lifetime and tack time depends on: | - Manufacturer | - Flux/mixture | - Environmental conditions | Typical lifetime is dep

Re: STATISTICAL PROCESS CONTROL. 6-SIGMA

Electronics Forum | Wed Jan 14 08:24:07 EST 1998 | Allison

Good luck in your conquest. I have been struggling with the same issues for some time now. I have made the following conclusions. First, it is nearly impossible to establish parameters in SMT to perform X-Bar and R charts. Electronics is not as cl

Re: SMT rework station

Electronics Forum | Mon Dec 29 09:37:25 EST 1997 | Craig Wilmer

| Can anybody give me feed back on the pro and cons of | using Pace, OK, Hakko, Metcal, etc... Kris, Pace is going to be your best bet when it comes to productivity. I used to do rework and repair for Compaq and all of the PCA lines in their manufa

Evaluating SMD Adhesives

Electronics Forum | Mon Aug 27 15:02:45 EDT 2001 | davef

It�s uncommon to test green strength. [Whatever �green strength� is. Some chip bonder adhesive suppliers have taken to taking about improvements in �green strength� their literature. We have asked sales types to quantify this and have never heard

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Tue Aug 28 13:46:46 EDT 2001 | mparker

To clarify on "Opportunities"- With 1000 components, the opportunities are far greater than 1000. You have 1 opportunity per component for a component defect i.e. bent lead, damaged part, tested bad, etc. You have a second opportunity per component

Electrovert Omniflo 7 reflow ovens

Electronics Forum | Thu Aug 30 11:59:00 EDT 2001 | Spanky

Hey all, I have 3 questions about reflow. Hopefully someone can help me. 1. I am having a problem. I set the peak at 230 and my mole thermocouples are telling me the temp in that zone gets to 237. How is this possible even if the thermocouple

glue measurement

Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george

Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m

glue measurement

Electronics Forum | Tue Oct 09 20:40:48 EDT 2001 | davef

No one suggested that you speak for other suppliers and nor would they want� you �to speak for them." You shouldn�t make this something that it isn�t. All that was requested courteously was suggestions of alternate suppliers that could be considere

Which side of PCB should be prefered for screening...

Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake

Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas


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