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Electronics Forum | Mon Dec 02 09:47:54 EST 2002 | davef
Most modern spec do not distinguish between process methods. So, there is no allowance "if you are using bla bla bla method, you should see ... . But if you are using bla bla de bla method, ignore that and look for ... ." Most specifications requi
Electronics Forum | Wed Dec 04 21:39:53 EST 2002 | davef
As you say, some BIG time force has pulled the metalization from the bottom of the component termination. From the pix it's hard to say whether it was caused by either: * Mechanical flexure of the board during an unusual heating or other processing
Electronics Forum | Thu Dec 12 12:17:00 EST 2002 | MA/NY DDave
Hi Fun Posts, Everyone beat me to the graphite solution, SHUCKS!! A dollar late again You know I didn't know that for years, and never gave it any thought. I felt dumb when I realized it since I was in soldering, knew about lead poisoning, and at
Electronics Forum | Wed Dec 18 12:49:04 EST 2002 | Mike F
I've used rice, too. The trick is to make the bag big enough to hold down the part or parts, but not so big it interferes with the top side heating of the parts around it. I've never actually used lead or steel shot, the heaviest fill material I ever
Electronics Forum | Sun Dec 22 11:02:44 EST 2002 | valuems
I am breaking a cardinal rule with this reply, but here goes. I believe almost every one is missing this one. Roger has hit the nail on the head. The gentleman is useing a clam shell printer and when the stencil lifts (too fast) and at the angle o
Electronics Forum | Thu Jan 09 10:47:36 EST 2003 | Hussman
Depends on what you mean by shifting towards each other. Otherwise, 7 mil should be fine for 0603. I've used 6mil, 7mil and 8 mil without problems. Generally, stencil thickness won't have a bearing on "shifting" parts. Check placement. Make su
Electronics Forum | Fri Jan 17 16:24:04 EST 2003 | MA/NY DDave
Hi I haven't seen the DEK software you describe in action or studied it, yet I will tell you to be careful of some of the software on the market even from good companies. Spend the time needed to understand how the software makes the calculations,
Electronics Forum | Mon Jan 13 16:24:15 EST 2003 | russ
Youch! I know this is going to sound stupid but.... I have done it in the past in limited quantities. We placed capton (polyimide) tape at each of the four corners for a similar situation. It did work but the operator has to be careful in placing
Electronics Forum | Mon Jan 13 21:52:16 EST 2003 | davef
Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the corners of the devices with balls composed of a "hard solder", yano something like 90/10. * Shimming to prevent excessive collapse of a heavy BGA during
Electronics Forum | Mon Jan 13 17:50:54 EST 2003 | jonfox
I was looking for some good documentation that could nail down some pros/cons of voids, but haven't found any. The biggest issue is if you are going to temp cycle the chips/PCB after assembly. Depending on the cycle, the situation of the test, it c
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