Electronics Forum | Mon Oct 13 17:50:30 EDT 2003 | davef
IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)" As you observe, the temperature you measure will depend on what you are measuring. For instance: * Hottest temperature in the oven - air in the oven * Hott
Electronics Forum | Thu Oct 30 00:12:13 EST 2003 | Grant Petty
Hi, Another option we have used here in house is to remove the unwanted BGA balls with solder wick, and then to manually place them on the PCB foot print. This eliminates the pick and place machine's optical centering freaking out because the balls
Electronics Forum | Thu Nov 06 07:54:50 EST 2003 | davef
First, skewing is a perfectly acceptable condition, providing the amount of skewing is not excessive. A-610 provides guidance. Second, this part is a land grid device. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA
Electronics Forum | Thu Dec 04 07:12:00 EST 2003 | ex maintain leader
Hi Mark, I'm ex Fuji smt service engineer, now I'm leading a a team wich repairs pc-boards in Europe. During replacing P4 processor socket I use an old srt-bga rework staion and an mimistencil wich can be placed abowe the bga pads. My 5 Y experience
Electronics Forum | Fri Feb 13 12:16:05 EST 2004 | Mike Konrad
Ashok, It is most likely not the DI water that is attacking the aluminum rather it is the saponifier. DI water is only in contact with the parts for a relatively short time. If your cleaning process provides for a rapid drying cycle, you should be
Electronics Forum | Sat Dec 20 02:35:27 EST 2003 | tommy
My boss who always like to read smt related mag,pick up what he can or don't understand from the article and blame all quality issue on engineering. We are seeing solder paste residue all over Juki printer equipment,on the floor,etc.This is mainly du
Electronics Forum | Fri Jan 02 17:47:21 EST 2004 | gpaelmo
Yes, We have done away with masking with kapton 8 yrs ago. As long as the goldfingers are leading edge you can use one of these: 1. rubber goldfinger boot/glove - contact east use to carry them...don't know if they still do. 2. fiberglass glove - ma
Electronics Forum | Tue Jan 13 18:29:35 EST 2004 | Tom B
I agree with Fastek. Universal tooling is the way to go if you got high changeover. Another option is Grid Loks support system (http://www.grid-lok.com/) Basically remove the ztower and add this system. It'll cost ya about 10K. Get board snugge
Electronics Forum | Fri Jan 16 07:06:47 EST 2004 | Mika
Component manufacturer often have recommendation for pad layout and process setup. This should be used as a guideline to help You to set up the process. Exactly what type of component is this, uBGA? We populate 64 I/O uBGA's on our pcb's with 0.3 mm
Electronics Forum | Wed Jan 21 09:26:36 EST 2004 | davef
On your finger supplier try: * JAFCO Products 10120 Cayuga Drive Suite 103 Dallas, Texas 75228 Ph-214-328-0070 Fax-214-328-3272 or 214-324-1484 http://www.jafcoproducts.com/products.html * NSC (Nozzle Supply Company) 33524 U.S. Hwy 280 East Childer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
Phone: 1-207-775-6139
