Electronics Forum | Thu Jan 04 13:22:31 EST 2007 | patrickbruneel
Yes Samir I�m aware of this, but thanks for reminding me. I posted this in Oct 2006 http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=10978&#Message44694 This is not going to affect us much because China is more expor
Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest
Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te
Electronics Forum | Tue Jan 16 10:58:42 EST 2007 | realchunks
Yes, it can evaporate. My point was manufacturers suggest cool storage to avoid seperation. I guess if the flux does seperate and get pushed to the top it could have a greater chance to evaporate. I have only seen such seperation on year + old jar
Electronics Forum | Wed Jan 17 18:08:51 EST 2007 | John S.
We use a fairly simple system. IPC put out standards 7912A and 9261A to define opportunities. Basicly the "number of components" + "number of solder joints" = "number of opportunities." Some six sigma benchmarking studies indicated "Sigma Level" =
Electronics Forum | Thu Jan 18 08:30:12 EST 2007 | CL,
Good Morning, We also are using Mirtec. We have a total of 5 machines now. 3 in SMT, 1 in RoHS and 1 in Through Hole. We have had incredible luck with these machines and their service is outstanding. I do not have any experiance with the other machi
Electronics Forum | Wed Jan 24 22:48:59 EST 2007 | frank63
Hello, we are facing some troubles with BGA opens in our production. PCB are both side popolated with BGA. BGA is array of 26*26, with some 6*6 center balls. PCB has 2 reflow processes, 4 pcs of BGA on each side. Now we are partly observing opens
Electronics Forum | Thu Feb 01 16:33:57 EST 2007 | mika
The reject rate of yours could be a number of reasons. 1. Which component types are rejected? 2. From a particular nozzle? 3. If the rejected part will be dropped on the reject belt or reject bin; it suggests that there is a problem with the componen
Electronics Forum | Fri Mar 02 10:06:28 EST 2007 | oldsmtdude
Agilent SP50 rocks for continuous improvement and pass-fail efforts. You'll see variation you never imagined you had prior. But be aware you absolutely have to monitor data and tweak your processes to improve results. Do not jump in and try and use
Electronics Forum | Thu Feb 08 08:28:11 EST 2007 | mzaboogie
Good Morning Everyone, We have an application coming up with several BGA's on a RoHS assembly. One is a 25 mil ball on a 40 mil pitch, another is a 15 mil ball on a 40 mil pitch. In the past for leaded assemblies, we have used square apertures for 1
Electronics Forum | Mon Feb 19 17:34:02 EST 2007 | GS
Thank You Pavel and Dave, Unfortunately I do not have IPC-4554. Anyway I 0.6-1.0umm is what I remember, and confirmed by reading also through leterature available on google. I was just going to understand if it possible to obtain more thickness
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