Electronics Forum | Mon Apr 19 11:26:32 EDT 2010 | davef
Independent Labs * American Competitiveness Institute; One International Plaza Suite 600, Philadelphia, PA 19113; 610-362-1200 F1290 info@aciusa.org * Bodycote Materials Testing , 847-676-2100, na.bodycote-mt.com * Foresite 765-457-8095, http://www
Electronics Forum | Thu May 06 13:06:36 EDT 2010 | dwonch
Unfortunately nothing ground breaking to report. The board shops analysis (SEM/EDS)showed high levels of carbon and oxygen, likely indicating an organic based contaminate. They are still stumped on where it is coming from. We recieved some boards y
Electronics Forum | Fri May 07 09:25:55 EDT 2010 | dwonch
Yes, the vias under the BGAs are the only ones capped. I tend to agree with you that the leaching should affect the bottom more than the top and that was actually the case with the two previous shops that had this problem. We suspected with those s
Electronics Forum | Sat Apr 24 10:43:31 EDT 2010 | davef
Hege: Sounds like this customer is a putz. Ask the putz to sign a release, acknowledging responsibility. Here's a couple more links on imm silver: * http://www.pcbdesignschool.com/wp-content/uploads/2009/08/the-study-measurement-and-prevention-of-t
Electronics Forum | Mon May 10 11:49:16 EDT 2010 | hegemon
A huge help in the very first statement, Josh. And yes, fixed vapor mass in the machine I am currently evaluating. OK, and a machine that can change the vapor volume based on a calculation of mass of the assembly sounds logical. (whirrrr,click... a
Electronics Forum | Tue May 11 15:56:10 EDT 2010 | davef
First, you mix the paste in the jar with the centrifugal thing-a-ma-jig. Then what? So, how are you going to get the paste from the jar into the syringe [cartridge], anyhow? Are you going to use an Atlas Tool? How are you going to de-air the syri
Electronics Forum | Sat Jul 03 15:14:25 EDT 2010 | scsi
Hege, can you share more info on the formulation you ended up using for the micro dot dispensing? I'm trying to find the proper metal load and viscosity for the auger valve dispenser that we are developing and it looks like the regular low viscosity
Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman
Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages
Electronics Forum | Wed Jun 16 07:35:28 EDT 2010 | scottp
Rather than tent the thermal vias, we use a small annular ring of soldermask around them and only print paste in the areas between the vias. Any way you go you're going to have voids under QFNs, so we just try to make it repeatable so our designers
Electronics Forum | Thu Jun 17 12:32:25 EDT 2010 | floydf
Last July I posted a query about reflowing leaded > paste to gold plated boards, I wasn't getting a > good reflow. The answer that seemed to work was > dwelling the board at reflow for the maximum > recommended amount of time. Would anyone have a
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