Electronics Forum | Thu May 03 10:14:10 EDT 2001 | davef
Now, I'm not going to talk solder balls, in a traditional sense. I have an image of bilbous, globs of excess solder near the ends of PTH leads. If that's not what you have, ignore the following [and help us understand your situation better] ... Yo
Electronics Forum | Sat Jun 09 14:28:58 EDT 2001 | Kelvin
No-clean solder paste is definately a trend for tomorrow. However, there are several points you need to consider before you shift from WS to no-clean: 1. Component quality - No-clean solder paste generally (not essentially) get a lower avtivity than
Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Fri Dec 10 12:40:44 EST 1999 | Brian W.
It sounds like the process is very labor intensive, and all the verification is done after the parts are soldered. Assuming you are hand placing the components: 1 - Contact Systems semi-automatic placement machine. It show polarity when placing, so
Electronics Forum | Wed Sep 22 22:32:40 EDT 1999 | Dave F
| We are finding solder shorts under 1206 Components on the bottom side of our boards.In all cases these shorts are from either side of the component to a feed-thru under the component body. Adhesive is used to glue down the component and then the bo
Electronics Forum | Wed Sep 01 13:48:29 EDT 1999 | Dave F
| Dear fellow process engineers, | | Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints
Electronics Forum | Sun Apr 25 10:28:46 EDT 1999 | Joe Cameron
Hello all, Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not filled
Electronics Forum | Tue Dec 29 04:27:08 EST 1998 | John W
| I have an inbteresting problem on my N2 wave soldering lines. | We have two N2 wave soldering line. Line A is old one and Line B is new. | We found solder balling Phenomenon on PCB After soldering in the new N2 Atmosphere Wave Soldering Machine. In
Electronics Forum | Tue Dec 22 17:12:26 EST 1998 | Dave F
| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,
Electronics Forum | Sat Oct 31 10:56:16 EST 1998 | Dennis Barry
| I finally got my problem figured out on the bridging, the | only thing I'm finding is that I notice some litlte solder balls on the bottom of the board. Is that normal? Is that why I'm getting bridges? Has anyone came across this problem and pass t
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