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Electronics Forum | Mon Feb 26 20:22:01 EST 2001 | davef
As a design rule, provide 0.050" minimum between parts to be "masked" and areas that require wave contact. The more the better is the general rule to apply. Check: http://www.autogroup.com/designguideb/ http://www.spprecision.com/ http://www.datumdy
Electronics Forum | Thu Apr 05 10:50:08 EDT 2001 | CAL
Per our staff here at ACI......... Higher Temperatures maybe necessary to achieve good solder process results. The alloy formed when HASL coating protects the copper is the same as that when OSP provide protection. Temperatures may be increased to im
Electronics Forum | Tue Nov 28 11:31:25 EST 2000 | Deon Nungaray
Hello Robert, As we are all aware the lead-free movement has been somewhat popular lately. We have had in depth discussions about materials, processes and procedures. How about training or re-training? I believe this would be one of the biggest chal
Electronics Forum | Fri Dec 03 19:44:34 EST 1999 | Russ
Hello all, I am in the process of converting our facility to noclean processes. So far I am experiencing troubles with soldering to gold finishes. The finish is an H.P. type1. The solder joints appear dull and grainy. They seem to be very strong
Electronics Forum | Wed Sep 30 04:36:54 EDT 1998 | Jacqueline Coia
Still cant get a fix to SMD soldering problems, Joints still look strong shiny and well wetted, although when pulled lead still coming away from pad, leaving a dull grainy looking space. This is occuring just after reflow (convection), no other proc
Electronics Forum | Wed Oct 23 14:45:00 EDT 2002 | Tom G
I haven't tried anything like that but had some experience with .8 mm pitch SSOPs. Immersion depth in wave was very critical- had to control Lambda pump speeds within 20 RPM and even then it would change as solder level dropped. Need thieving pads o
Electronics Forum | Fri Feb 21 19:49:36 EST 2003 | MA/NY DDave
Hi Good Luck Neil, When I first saw this process described, what you are experiencing was my first visual thoughts. Partial filling as well as huge solder voids inside of the joints. I figured for low reliability product or short life maybe this t
Electronics Forum | Mon Apr 12 10:39:48 EDT 2004 | Ron Herbert
Correct preheating of the assembly is critical. Check with your flux manufacturer regarding the recommended topside pcb temperature as it enters the first wave. It is important that this temperature be achieved without burning the flux on the bottom
Electronics Forum | Wed May 04 08:41:01 EDT 2005 | Hannu
OK, granted, this is not exactly your hi-tech SMD production but pertains to lead-free so I'll post this anyway: Can anybody share their experiences on lead-free dip soldering of transformer terminals? I have not done any testing myself but have see
Electronics Forum | Mon Dec 04 21:42:12 EST 2006 | KEN
Keep in mind that device pitch, pad geometry, lead length and even alloy type will play a roll in your evaluation. I have an assembly that we run 10k pieces per month. One two-pin connector has a pitch of 1.27mm. Unfortunately, the pads are 0.007"
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