Electronics Forum | Fri Jul 27 13:51:53 EDT 2018 | vlad_saviuk
Hi, have some question: during solder paste printing I'm faced with problems on the edge of the PCB - solder balls on gold pads. During analisys we checked everything - change squeegee preasure, different cleaning cycles, squeegee speed - no effect.
Electronics Forum | Mon Sep 24 11:28:55 EDT 2018 | etmpalletguy
Use a solder pallet, the pallet will mask off the locations required, thus eliminating the need for any kind of masking!! You've eliminated the need to apply, but you still have to peel off, not much of time saver. Pallets can be used for batch or s
Electronics Forum | Fri Jan 04 06:28:27 EST 2019 | ameenullakhan
Hi, We are observing solder joint discoloration ( yellow color appearance ) in one of assembly after secondary reflow run. Please provide your valuable feedback. Solder paste : water soluble lead free Alloy : SAC305 Flux : ORM1. Please provide v
Electronics Forum | Mon Feb 18 07:49:17 EST 2019 | SMTA-Joe
the tarnishing is happening across all the traces without solder even being applied. The PCB is soldered into the housing first. Once this is complete the traces have changed, and when it is time to solder the components to the traces this tarnishing
Electronics Forum | Mon May 06 06:22:39 EDT 2019 | SMTA-Rogers
Hello! Do you have a better stencil design to reduce the large area of solder joint voids? Or is there a suggested way to set the reflow profile? Or are there other process improvements to make the solder joint at the LED pad less than 10% per void?
Electronics Forum | Wed Dec 11 10:25:46 EST 2019 | engmagana
Dear Ameen, We have proved to the customer than the solder fillet obtained after the solder reduction is enoug by bracking some parts and obtainig more than 200 Newtons before and after, the problem has deminish but not yet solved , next step is re
Electronics Forum | Tue Sep 24 18:38:54 EDT 2019 | researchmfg
Well, there may be a misunderstanding that people think the IMC layer grows the thicker the more strong soldering strength. Actually, the IMC layer can be grown and distributed evenly at the interface between Cu-based, Ni-based and Sn-solder will be
Electronics Forum | Fri Oct 18 00:44:56 EDT 2019 | Aqueous Technologies
I know you mentioned you use a Tech Spray product. We have had success with their "Wondermask" water soluble product. When using a chemical additive (saponifier) in an aqueous cleaning system we have not experienced residues. I hope that helps. https
Electronics Forum | Tue Nov 05 11:53:50 EST 2019 | markhoch
Does anyone have any experience trying to solder Anticapillary or Silicone Blocked (SBT) wire? It's designed to inhibit wicking of liquids and unfortunately that includes molten solder. We're experimenting with it for a potential high volume applicat
Electronics Forum | Thu Nov 14 21:57:47 EST 2019 | sssamw
yes, first of all you need confirm if solder ball around solder pad has same location, if so then check squeege if has worn area or not at same location. If not, please check sodler paste itslf to see if dry a little, if so all paste could be a littl
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