Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla
I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.
Electronics Forum | Wed Jan 02 15:48:56 EST 2008 | pjc
Try these guys: http://www.avipre.com/products/wave/wave.php http://www.wave-solder-fingers.com/products.html Faiton is selling them at 1/2 price here: http://www.equipmatching.com/used_equipment/2/265/75079.php
Electronics Forum | Thu Jan 03 11:00:03 EST 2008 | patrickbruneel
As Dave said stainless steel can not be soldered using fluxes designed for electronics. The only way this could be done is to spot plate copper or tin where you want to make the solder connection.
Electronics Forum | Fri Jan 04 16:15:05 EST 2008 | ck_the_flip
Good move. Again, stainless can NOT be soldered with standard materials used in electronic manufacturing, as everyone agrees in this thread. Additionally, the physical properties of stainless have to be altered in order for soldering to take place.
Electronics Forum | Thu Jan 10 09:25:45 EST 2008 | mleber
How many are using solder tip tinner? We were recently told that our tinner was shortening the life of our tips. We are using JBC irons / tips and an entirely leaded process (military) Any leads or sites on tip tinner greatly appreciated.
Electronics Forum | Wed Jan 16 08:58:43 EST 2008 | Adam
Hi If I have an assembly where the solder joints are suffering from blowholes and Pinholes. Could these solderjoints be reworked/touched up to form a reliable/acceptable solderjoints ?
Electronics Forum | Wed Jan 30 21:52:06 EST 2008 | rayjr1491
What is commonly done in the industry regarding when to clean the stencil, squeegees and replenish the solder paste? Is it every 4 hours, 8 hours or something else?
Electronics Forum | Thu Feb 14 12:44:48 EST 2008 | operator
Don't worry about the paste print. Just omit it from the stencil. Mask over all the SMT components after reflow with water washable WSOL masking. Then run it thru the wave to deposit the solder. Then wash to remove masking. Or you could manually run
Electronics Forum | Thu Feb 14 08:14:12 EST 2008 | davef
Questions are: * Do the BGA pads on the board take solder when you solder them by hand? * What is the temperature on the BGA pads during reflow? * What is the temperature on the other component pads during reflow?
Electronics Forum | Wed Feb 20 16:55:52 EST 2008 | flipit
Pd/Ag doesn't usually dissolve (leach) nearly as bad as Ag only. In my hybrid days, we would use 62/36/2 solder. The 2% silver helps saturate the solder joint and thus keep the Ag from being leached away by the Sn.
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