Electronics Forum: soldering (Page 656 of 2099)

Adhesive Dispense Equipment

Electronics Forum | Sun Oct 28 23:32:25 EST 2001 | flynhi34

Thanks for the info on the printers. I have printed conductive epoxy on Dek 265 with great success in the past. The issue I have is that I need to attach with both epoxy and solder on the same side of the PCB. I could double print. Print conductiv

Voiding in uBGA's w/blind uvia's in pads

Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera

Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo

Solder Paste Printed Volume

Electronics Forum | Mon Nov 26 23:05:05 EST 2001 | ianchan

M.Parker, thanks a million!

PWB Pad Finish & dewetting

Electronics Forum | Thu Dec 06 19:46:08 EST 2001 | davef

First, we�re assuming that we�re talking hot air solder leveled [HASL] bare boards, eh? Consider using A-600 - Acceptability of Printed Boards as the basis for discussing the bare board problems. It is the bare board analog of A-610 - Acceptability

BGA solder joint integrity

Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain

Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly

Soldering stats

Electronics Forum | Wed Jan 16 20:05:04 EST 2002 | davef

Look here http://www.infoxpress.com/reviewtracker/reprints.asp?page_id=916

SMD solder joint calculation

Electronics Forum | Wed Jan 16 12:04:45 EST 2002 | dason_c

You can use the IPC-7525, Stencil Design Guidelines for start up.

Wave Soldering and Through Hole Forums

Electronics Forum | Thu Jan 24 09:53:56 EST 2002 | davef

You didn�t tell us about your solder, wave temperature profile, or the distribution of the problem. So, let�s assume the solder is near eutectic and the problem is wide spread. Wolfgang makes good points. So, let's talk a different tact. When we

lead coalescence in solder joint

Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto

Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures

Wave Solder Troubleshooting chart

Electronics Forum | Tue Feb 05 19:41:01 EST 2002 | PeteC

I sent you an e-mail with an attachment of a troubleshooting chart for wave and reflow.


soldering searches for Companies, Equipment, Machines, Suppliers & Information

Beau Tech
Beau Tech

A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.

Manufacturer

98 Elm St.
Portland, ME USA

Phone: 1-207-775-6139

ISVI High Resolution Fast Speed Industrial Cameras

High Throughput Reflow Oven
Void Free Reflow Soldering

High Precision Fluid Dispensers
pressure curing ovens

World's Best Reflow Oven Customizable for Unique Applications
High Throughput Reflow Oven

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...