Electronics Forum | Thu May 31 10:52:31 EDT 2007 | patrickbruneel
A solder wire classified as L0 under IPC J-STD-004 means that the flux residues can be left on the board safely, and when you select this type of cored wire the intention is not to clean. You just select a solder wire that gives you an acceptable lev
Electronics Forum | Thu Jun 07 07:30:16 EDT 2007 | jdumont
What type of residue is it. Are you sure its not the solder mask turning white? Odd that it would only be on the bottom...
Electronics Forum | Sun Jun 10 23:25:30 EDT 2007 | slthomas
Could you justify a used printer with 2d inspection built in?
Electronics Forum | Mon Jun 11 10:13:26 EDT 2007 | hussman
I would also "nice to have" because of your process. Inspecting solder paste from a 2D point of view manually would not assure you quality if the paste is 75% off pad. Plus hand placing onto solder paste causes it's own set of problems which will c
Electronics Forum | Thu Jul 05 20:53:58 EDT 2007 | davef
ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires
Electronics Forum | Fri Jul 06 10:11:02 EDT 2007 | blnorman
Solderability testing and if possible, measure the plating thickness (XRF).
Electronics Forum | Thu Jul 12 17:52:06 EDT 2007 | swag
Are you talking about problems with your product or your SMT/wave solder equipment?
Electronics Forum | Mon Jul 16 11:25:22 EDT 2007 | davef
For the problem part, describe the pads on the board and the aperatures on the stencil.
Electronics Forum | Tue Jul 24 07:15:16 EDT 2007 | james
We are currently have failures on one of our QFN components. We are running this product with lead free paste, lead free boards and lead free parts. They have done a pull test on this component and it showed that the solder joint mainly dissconnect
Electronics Forum | Fri Aug 03 09:37:12 EDT 2007 | patrickbruneel
Grant, The difference is that the plating makes the connection between circuitry and components no need for soldering anymore.
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