Electronics Forum | Mon Mar 22 19:46:17 EST 2004 | pdeuel
The bottom side is going into reflow somewhare near melting point of solder. Reduce bottom side temprature. Get a good mole so ramp and soak tempratures can be checked on bolth sides of the PCB. The object is to keep bottom side parts from approching
Electronics Forum | Tue Mar 30 02:58:55 EST 2004 | Grant Petty
Hi, Thanks for the ideas. With the solder mask curing problems, can you normally wipe off the white residue, as we can do this on our boards with our fingers. It's almost like the surface of the board has a "wet dried up" look to it, and it's a smok
Electronics Forum | Wed Mar 31 20:49:11 EST 2004 | marcowong
We are trying to buy used double wave solder and ICT machine and we need some advice on selecting the machine and things to be cautious with. It will be greatly appreciated if someone can offer us good suggestions that will help us to minimise mist
Electronics Forum | Thu Apr 01 12:05:21 EST 2004 | babe
Heat guns scare me, hot air scares me too. Just the heck of it why not apply high temp paste to the center and eutectic 63/37 standard solder to the outside pads. The outside reflows first allowing proper seating of the component and with a proper pr
Electronics Forum | Fri Apr 09 20:28:14 EDT 2004 | Ken
I have experience in this. My company offers Lead free SMT and Wave soldering. I have processed ImSn, ImAg, Enig, OSP in both smt and wave. Yes, silver leaching will occur. Yes, copper leaching will occur. High tin content solders disolve everyt
Electronics Forum | Tue Apr 13 08:25:15 EDT 2004 | arcandspark
I would have gone to a .004" stencil but again, the board designers, which we have no control over or are we allowed to give input to, have made the pads on all connectors and many other parts so small that we are almost seeing insuffecient solder us
Electronics Forum | Thu Apr 15 11:13:24 EDT 2004 | pjc
Sn corrosion effects were studied for stainless steels, coated stainless steels, titanium, cast iron, and other materials. This study can be found in the SMT Library under "Equipment Impacts of Lead-Free Soldering" Electrovert uses a Melonite coating
Electronics Forum | Wed Apr 21 19:59:43 EDT 2004 | Ken
It makes no difference if the solder is in balls, ingots, bars, paste etc. The thermal profile satisfies key areas of the reflow process as a function of your flux and alloy type. Peak and duration above liquiduous are a function of the alloy. pr
Electronics Forum | Wed Apr 28 12:13:57 EDT 2004 | Jack
You can find the procedures for different package types in the IPC-7711 & 7721 manuals. These can be purchased from the IPC.[http://www.ipc.org/] You can also try Circuit Technology: http://www.circuittechctr.com/guides/guides.shtml These manuals and
Electronics Forum | Tue May 04 14:27:32 EDT 2004 | michasm2
Both are acceptable methods. - Printing on the board may give your operators a better ability to catch insufficient solder due to poor release; however if done right, printing directly onto the BGA ball is much more efficient and eliminates any compo
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