Electronics Forum | Mon Jul 07 10:38:53 EDT 2008 | realchunks
Biggest differnce is tooling. Tooling cost with a fixed pot - no tooling cost with programable "moving"pot. There are various way to control peel off with a moving pot. Depending on the machine, you can use either the Z axis or the actual pump spe
Electronics Forum | Mon Jul 14 13:36:03 EDT 2008 | stepheniii
Most "non-moving pots" are tooled piece of steel > with pockets full of solder. At least that's > what the marble in my head understands it be (?). Our Selective solder machine has a fixed pot with a fountain in the middle of it. The table move
Electronics Forum | Wed Jul 09 10:15:57 EDT 2008 | aj
I have carried out some further measurements on the device and the results are as follow: Component Lead width measures 183 microns. Actuals PAD width measures 158 microns. What I am thinking is that the lead is attracting the solder hence prevent
Electronics Forum | Tue Jul 08 15:37:14 EDT 2008 | realchunks
Volume that appears to be caused by wetting. Now remember most solder pastes will not "flow" across an entire pad. It will only flow where it is printed. In your pic, if the pad was covered and came out like this - it may be your pad. If it was
Electronics Forum | Sat Jul 26 07:31:14 EDT 2008 | bobwillis
We have created a new online free database on process defects at NPL which you can search. http://defectsdatabase.npl.co.uk There are many reasons for solder balling on wave and reflow and examples are provided. You could always use the database t
Electronics Forum | Mon Aug 04 13:13:21 EDT 2008 | patrickbruneel
The 2009M is a water based flux and requires more preheating compared to alcohol based fluxes. After checking real chunks advice you might check if you hear sizzling when the solder touches the board (indicator that the water is not eliminated by you
Electronics Forum | Sun Aug 03 08:27:41 EDT 2008 | davef
IPC-4553, Specification for Immersion Silver Plating for Printed Circuit Boards, 1.4.1 Solderability. This primary function of IAg is to provide a solderable surface finish, suitable for all surface mount and through-hole assembly applications and wi
Electronics Forum | Mon Aug 11 15:44:41 EDT 2008 | stimpk
Although its a fairly rough image to look at I'd think you more of a reflow or paste issue. Looking at the two resistors, they don't look so good either. Although they maintained their placement alignment the solder does'nt appear to have flowed cor
Electronics Forum | Tue Aug 12 07:35:23 EDT 2008 | stevezeva
Hi, Is the footprint per the component manufacturers recommendations? The reason I ask is because it kinda looks like the pads are extending beneath the component. Could cause the part to float up on top of the solder and not allow the leads to wet
Electronics Forum | Mon Aug 11 10:35:32 EDT 2008 | realchunks
What does your top side wetting look like? This is a perfect case where top side wetting will tell you when you have a good joint. Without seeingor knowing your process, I would suggest either more pre-heat or longer dwell in the solder. Either on
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