Electronics Forum | Wed Sep 01 07:44:36 EDT 2010 | sachu_70
Dear SMT-manufacturer, I would recommend to also have other device joints on board X-ray inspected to understand if void formations are seen across the board or confined only to one component. If seen across, your "Reflow Profile" could be the cause
Electronics Forum | Wed Sep 01 10:15:44 EDT 2010 | arjan
Dear Sachu_70, During the tests we also checkt other devices, there are a few small voids visible, but they are marginal. We only see large voids in this device. During the testruns we tried several reflow profiles, but without large succes.
Electronics Forum | Thu Sep 02 04:51:35 EDT 2010 | sachu_70
Seems interesting ... I am certain this could be resolved. But first one question: How did you monitor the reflow profile at this component? How and where was the thermocouple connected?
Electronics Forum | Thu Sep 02 05:08:12 EDT 2010 | arjan
We drilled a hole in the centre of the LGA and put the thermocouple inside, so we measure the exact temperature between PCB and device.
Electronics Forum | Wed Mar 15 07:20:23 EDT 2017 | emeto
Hello experts, would you please share what kind of dross reducers you use or used and you are happy with? We don't use any, and I am interested in implementing one.
Electronics Forum | Wed Feb 19 12:14:08 EST 2020 | emeto
Use them always - they help for even preheat of the board. If there is a temp sensitive/melting component on top side, turn them off.
Electronics Forum | Thu Sep 24 08:05:59 EDT 2020 | majdi4
In my opinion, it is not possible to eliminate the oxidation in a component because oxidation it is not removable .. the only solution is to apply a mechanical operation (scraping) and then tinning the part..
Electronics Forum | Thu Jul 13 19:22:01 EDT 2023 | saucyshawn
I have been very happy with Pillarhouse. Exact model for you would depend a lot on batch vs inline. We are using the Jade Prodex.
Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek
This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet
Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef
Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c
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