Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef
There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio
Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef
There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass
Electronics Forum | Wed Jan 30 12:53:58 EST 2008 | tonyamenson
In approximately one month I am installing 2D at our DEK print station. We are going with the basic (cheap) software options and 2D camera. After it is up and running we will determine if it is indeed useful. At that point we will decide on the adva
Electronics Forum | Fri Apr 25 11:38:22 EDT 2008 | vortex337
Our company has run into an issue with de-wetting of lead free components. Our profile is dead on with paste manufacturers specs. We have had this issue with both gold immersed, and hot air leveled boards. We have tried three different solder paste m
Electronics Forum | Mon Jul 14 16:11:58 EDT 2008 | ck_the_flip
Pat, Try to run a glass plate (yeah I've used these before too), keep your wave pump speed the same, and slow down your conveyor speed. You will find the actual contact between molten solder and the 0.5" grids to be LESS vs. a faster conveyor speed
Electronics Forum | Tue Jul 15 16:12:23 EDT 2008 | boardhouse
Hi Armynski, I sell for an offshore board house, yes, it is common for offshore board shops to fill vias. The bubble is caused by air entrampment within the hole it self, when heat is applied during Hot air and the via is covered on both sides the e
Electronics Forum | Wed Aug 13 09:50:32 EDT 2008 | diesel_1t
Hi dave, thanks for your reply I tried to locate "Techni-Tool 872M1034" on the webpage but I found: https://webvia.techni-tool.com/VIA/viaImagePageIndex.jsp?row=3&pgName=viaListProducts.jsp&searchText=CH8C&modifier=CH8C&reqTitle=TITLE_VIAUSERDOCLIST
Electronics Forum | Fri Aug 29 10:37:44 EDT 2008 | gdzuber
Very interesting problem because it shows how systemic this kind of problem can be. So many variables, right? Firstly, discussions here are similar to everyone's postings, but there are some different observations. The manufacturer��s profile, we t
Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
Electronics Forum | Tue Sep 30 14:14:17 EDT 2008 | ck_the_flip
I've done it 3 different ways in my career (3 different places): 1.) Process Engineering was responsible for solder paste inventory (as well as all other process materials). That was a bad situation due to the blame factor. 2.) TOOL-CRIB control
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