Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais
We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua
I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g
Electronics Forum | Wed Dec 09 18:51:06 EST 2020 | johndep7
My company has been having issues with a lot of solder balls, solder splash, and flux balls all over a specific board. Now this is one of the only companies that require us not to clean our boards after our work is finished but this is also causing a
Electronics Forum | Thu Jan 27 11:33:59 EST 2005 | russ
For what you have right now I would recommend that you use soldering iron tips that are made for component removal. until you get BGAs I wouldn't worry a whole lot about the expensive rework equipment. I would use specialty tips and a heat gun wit
Electronics Forum | Fri Oct 10 14:38:26 EDT 2008 | smt_guy
Hi, Where can I find good information regarding the specific soldering iron tip for specific component package that they can be used? Is there any websites for this? thanks and regards,
Electronics Forum | Thu Oct 16 10:17:51 EDT 2008 | kevslatvin
I'd start by looking at the available tips from the manufacturer of the iron you are using. They usually have a selection of specialty tips in their catalog either online or in print.
Electronics Forum | Fri Jul 24 07:43:56 EDT 2009 | davef
Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperatu
Electronics Forum | Wed Apr 27 14:10:30 EDT 2005 | Bruno Lalonde
I m looking to implement a maintenance program here at Exfo, I'm looking form the norms on the hand soldering iron (tip to ground resistance and Voltage linking). Thank
Electronics Forum | Wed Apr 27 21:59:34 EDT 2005 | davef
Check with your soldering iron supplier. We'd expect them to say: * Tip to Ground Resistance:
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