Electronics Forum: soldering and iron and requirement (Page 1 of 13)

Manual soldering - solder wire diameter and soldering iron tip size for different component sizes

Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais

We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 09:45:08 EDT 2007 | pjc

CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef

UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n

Selective soldering pallets and solder balls

Electronics Forum | Mon Dec 16 17:35:43 EST 2002 | davef

Jim Consider issuing a purchase order to your assembler for the purchase of selective wave soldering pallets required to solder your board. That way, you: * Own the pallets. * Can take the pallets with you should you decide that another assembler

Selective soldering pallets and solder balls

Electronics Forum | Tue Dec 10 14:10:38 EST 2002 | Randy Villeneuve

Steve, I wave solder most if not all our boards with selective wave pallets. I did not catch if the solder balls were on top of the board or on the bottom but that will make a difference on what to do to get rid of them. Pallets are good and bad. On

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Wed Dec 09 18:51:06 EST 2020 | johndep7

My company has been having issues with a lot of solder balls, solder splash, and flux balls all over a specific board. Now this is one of the only companies that require us not to clean our boards after our work is finished but this is also causing a

Rework and repair system suggestions

Electronics Forum | Thu Jan 27 11:33:59 EST 2005 | russ

For what you have right now I would recommend that you use soldering iron tips that are made for component removal. until you get BGAs I wouldn't worry a whole lot about the expensive rework equipment. I would use specialty tips and a heat gun wit

solderability and hasl thickness

Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef

Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder

black and grey pad

Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua

I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g

Solder Paste and Stencils

Electronics Forum | Tue Oct 12 10:24:50 EDT 1999 | Jose RG

Hi, We are in the way to evaluate different solder pastes, improve our solder paste incoming inspection steps, re-define our stencil requirements and the following questions are open. Two questions, 1- Is anybody using/requiring 1000 Kcps or more

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