Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef
Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur
Electronics Forum | Fri Jan 23 10:39:35 EST 2004 | patrickbruneel
Kris, I assume with voids you mean acceptable solder coverage of pad and lead. As Dave mentioned I also have not seen any specific studies on voids, but workman ship standards exist about acceptable coverage of pad and lead (both consumer and MIL)
Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks
Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem
Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin
Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole
Electronics Forum | Wed Feb 28 00:01:47 EST 2007 | Muhammad Haris
Hi, The distance between the two terminations/endings/pads of 0603 (0201)is 0.15mm i.e. lesser than than the distance between the 0603 and through hole i.e. 0.5mm My ques is that, then why its termination doesnot short as it has a minimum distance.A
Electronics Forum | Sat Sep 06 05:11:21 EDT 2014 | padmalathab
Hi Thanks for responding to my query. Our PCB Assembly consists of both SMD and THD components. Also,assembly will be done by machine as well as Hand soldering based on the requirement. I request you to suggest Poka yoka tool to read the value of
Electronics Forum | Thu Jul 20 16:08:18 EDT 2000 | Grant Baynham
Do you have any experience with flip chip applications using lead-free solder, and specifically do you have any information revealing how the process parameters for standard air reflow atmosphere can be modified to match the results for solder reflow
Electronics Forum | Fri Apr 06 09:45:08 EDT 2007 | pjc
CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
