Electronics Forum: soldering and pull and test (Page 1 of 14)

Solder beads and wave soldering

Electronics Forum | Thu Jul 06 03:03:56 EDT 2006 | ronalds

Thank you all for your input. The MF300S Multicore flux is rated for lead free. There is not much dross or contamination. We are using nitrogen. I've tested the boards with the curing test of IPC-TM-650. I think you're all right about the preheat.

Solder beads and wave soldering

Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds

Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris

Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to

Automated soldering station (pros and cons)

Electronics Forum | Fri Jan 29 11:23:54 EST 2010 | ppwlee

Smtnet, I am looking at pros and cons for automated soldering. The application is a simple multi pin through-hole soldering on a high volume manual assembly line. The goal was to eliminate defects associated with missing solder pins which goes undet

SPC - Reflow and Wave soldering

Electronics Forum | Fri Sep 06 14:07:20 EDT 2002 | ppwlee

Thanks for all replying to my printing SPC posting. I like to expand the SPC discussion on reflow and wave soldering. I am aware of the common methods of applying periodic measurements using test vehicles though the machines to collect critical pr

Can dye and pry test reveal which solder joints fail first?

Electronics Forum | Mon Jul 07 09:47:50 EDT 2008 | davef

Dye & pry test reveals the solder connections that have failed prior to performimng the test.

Heat guns and component damage

Electronics Forum | Tue Jan 31 15:40:44 EST 2006 | mgdrouin1

Comp is relay. I've pulled the spec. Max 240. Using Leister h/g with manual temp settings from 1-6 (20 - 600C)set by the operator. Gun was set to setting 4. They are using the heat gun to reflow the solder after SMT but before wave. High fai

Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert

I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i

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