Electronics Forum: soldering and spash and cover (Page 1 of 4)

Reflow soldering problems and traces under component

Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev

Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

WSOL and solder pot

Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator

I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.

0402's and Gluing.............

Electronics Forum | Wed Feb 09 21:19:03 EST 2005 | Mrduckmann2000

Russ, We can not use a wave pallet, already went that route. We have parts next to the thru-hole pins and between thru-hole pins. I am going to try an experiment in the next day or so with solder mask. I plan to solder SMT parts on the back of se

Material Ageing and Storage

Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL

SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed

SMT Adhesive and Other

Electronics Forum | Thu Feb 07 14:58:08 EST 2008 | operator

We don't have one of those cool air compressed syringes to dispense adhesive. We have to do it by hand. My question is does anyone have any suggestions on syringe size, needle size etc... for successful deposition of SMT adhesive? I know you can go s

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

Lead-Free Finish Boards and Components

Electronics Forum | Wed Jul 07 13:56:57 EDT 2004 | Pierre RICHARD

As converting our boards to lead-free finish (Immersion White Tin) we decided to change de mask color from green to blue. We thought this would be a good idea to spread the idea so we could easily recognize the type of solder application related to t

SPI and AOI Machine Feaures.

Electronics Forum | Wed Feb 10 05:23:17 EST 2021 | karl_willoughby

Hello. I am sourcing machines for an SMT line (for the first time) and would like to understand features of current and earlier model SPI and AOI machines. In the intended application, a high volume of PCAs aren't required to be processed but there

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