Electronics Forum: soldering lid (Page 1 of 4)

lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Thu Sep 17 07:06:15 EDT 1998 | joakim fagerlund

We have problems with voids when we solder lids to ceramic flatpackages. The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel The solder is attached to the lid (preform) and the solder material is Au/S

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach

| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy

| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Fri Sep 18 08:49:12 EDT 1998 | Earl Moon

| | We have problems with voids when we solder lids to | | ceramic flatpackages. | | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | | The solder is attached to the lid (preform) and the solder

Reflow SLX PCBs on Flowstar 4036

Electronics Forum | Fri Sep 24 14:15:58 EDT 2010 | emrtech

we have been doing reflow on SLX PCBs and found out that when lidding, the components have been shifting. Has anyone been doing low temp lidding on SLX PCBs using the flowstar 4036 soldering system? If so, what low temp solder was used and profile

CERSOT-23 solder on top of package

Electronics Forum | Tue Jul 25 13:40:04 EDT 2017 | davegoad

I have some CERSOT-23 transistor packages with castellated terminals. The 4th lead (drain castellation) is electrically connected to the top of the device by the castellation. The castellation goes up the ceramic body and contacts the metal package

Shield Clips

Electronics Forum | Mon Sep 10 17:07:23 EDT 2001 | Dave G

I've mounted the $%&R$#$&%$(&! pain in the neck shield clips in the past. (Excuse the simulated profanity- I couldn't help myself.) What we went to was a frame & shield combination. (The frames are cast & then plated w/tin. We have used both plastic

Clean the No-Clean

Electronics Forum | Mon Feb 13 12:57:54 EST 2006 | Chunks

I'd check around for a wire solder that doesn't leave as much residue behind or a "clearer" residue behind. Or tell your customer you can save them a few bucks by just soldering a few points on the lid (since it's a air tight seal).

Indium Solder Hermetic Seal Voiding

Electronics Forum | Tue Jan 09 21:21:22 EST 2007 | behrsam

I am soldering a Germanium Window with a metalized rim to a Ni-Au plated kovar lid. The solder joint needs to be hermetic. I am using 80In solder washer shape preform, but am experiencing lots of voiding when x-rayed, although the joint is sealing.

Help for replacing BGA with metal heat sink

Electronics Forum | Fri Sep 26 08:15:01 EDT 2003 | Gabriele

Forced gas (hot air or N2 according to solder paste or flux) will be the solution. To rework Ceramic (Aluminum lid Heat Sink)BGA (32 mm square ) or Ceramic Colum Grid Array C-CGA 1,25 and 1,00 mm colum (pitch 42,5mm square), also them capped with a

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