Electronics Forum | Wed Jun 19 18:29:26 EDT 2002 | surinder
Is somebody has Comparison data between SMT Glue & Solderpaste process.I know,the paste printing process is better to achieve high yields,but I want to see some Comparison data in terms of rework.
Electronics Forum | Fri Jun 21 16:41:10 EDT 2002 | pjc
If your wave machine has the new style Rotary Chip Wave and the Hot Air De-Bridging Knife options you can expect good yields. However, depending on the PCB design, double-sided solderpaste reflow and selective solder pallets for wave solder is a bett
Electronics Forum | Fri Jun 21 13:05:58 EDT 2002 | surinder
Hi Stephan, Thanks,Yes there are thieving pads on Ic's .Also the two QFP, which mention,that will be removed by modifying the design in long run ,if the results/Yields are okay as with Glue as Compared to solderpaste process. Yes you are right here,b
Electronics Forum | Thu Jun 20 12:52:09 EDT 2002 | surinder
Thanks for the reply,Yes the data should show the yield difference from Paste printing process to wave solder process.I mean if we have Low yield that means more rework in that Case-Thanks & looking forward to get more information Surinder
Electronics Forum | Thu Jun 20 10:48:56 EDT 2002 | Hussman69
When you ask for data in terms of rework, do you want reflow solder yields versus wave solder yields? Or do you want repair data from each process, or yield data that shows actual glue defects from screen printing versus solder paste screen printing
Electronics Forum | Thu Jun 20 16:59:57 EDT 2002 | davef
We look at gluing and pasting second side components as two different processes, NOT alternative processes. Given our drothers, we'd paste / place / reflow all day long, before we'd want to glue. We glue because we have to glue. The main driver to
Electronics Forum | Thu Jun 20 19:27:28 EDT 2002 | surinder
Hi Dave, I am agree with you,but one of my customer want to know the difference in terms of rework/Quality,if we go for Glue process in place of solder paste and want to see some data We have board ,which have Through hole components and smt comp. on
Electronics Forum | Fri Jun 21 12:49:58 EDT 2002 | surinder
Hi Russ, Thanks for your input.My board has SMT Chip components, SOT23,SOIC's & 2QFP (25MIL PITCH). Also,taking consideration that the board is well design for Wave.This board has been designed end of last year. We have latest model of Electrovert ma
Electronics Forum | Fri Jun 21 12:59:20 EDT 2002 | stepheno
When you say well designed for wave, does that include "extra" solder pads for the IC's for solder thieving? And Boards that are well designed for wave don't have QFP's on the bottom. They might be ok but then the board would be "ok for wave", but no
Electronics Forum | Sat Jun 22 21:06:27 EDT 2002 | jersbo
I agree with PJC.. The mention of 2 QFPs to wave = more than likely rework to remove bridges and a potential to scrap the board, 25mil isnt as bad as 20 or less.. but the potential is still very real.$$$$$$ reflow/reflow is my 2 cents with the possib
