Electronics Forum: spec (Page 131 of 186)

Wave soldering

Electronics Forum | Tue May 28 13:14:31 EDT 2002 | zanolli

Hello Mark, I'll assume that you are currently wave soldering and would like to eliminate that operation by using pre-forms or press-fit connectors. Solder preforms or solder flux bearing connector leads usually do not require any hole size changes,

environment Operational deg-C and RH% for Paste Printer

Electronics Forum | Thu Jun 06 09:45:14 EDT 2002 | Hussman69

We based ours on the type of paste we use (stencil life) and not so much the machine. Then we coupled that to what 'true' conditions we normally see in our plant, and determined that under these conditions Max & min) our printing process should be g

Factory Lighting - specs and measurement ?

Electronics Forum | Mon Jun 17 15:04:08 EDT 2002 | genny

I think I had my units wrong in my previous post - that blueprint job was 6 years ago and fading fast. My level of 700 would have the same units as Dave's level of 1000. This is the metric measurement of lux, vs the imperial footcandles. fc to lux

REFLOW SOLDERING OF THROUGH-HOLE COMPONENTS

Electronics Forum | Mon Jun 24 18:45:06 EDT 2002 | jersbo

I have done experiments on small runs, with a few connectors and have had favorable results, I had apertures (oversized)made for the thru-hole connectors on our SMT stencil and hand inserted the connectors.. A few insufficient solders here and there

Reflow PBGA

Electronics Forum | Wed Jun 26 01:01:24 EDT 2002 | ianchan

Steve, Dason has valid points here. dun listen to what supplier's say about paste lying on the PCB pads able to be exposed at ambient temperatures for 8-24 hrs? that will never get approval for Class-3 type of customer auditors. (Would any serious

Reflow PBGA

Electronics Forum | Wed Jun 26 21:41:46 EDT 2002 | ianchan

Hi mate, "no more than 6hrs in the stencil" for us means: 1) we finish setup of reflow oven, P&P m/c, and lastly the printing machine(includes loading of stencil into printer machine). 2) once printer machine is setup, we rip-open the paste Can pr

SMT COMPONENTS

Electronics Forum | Tue Jul 16 07:33:32 EDT 2002 | pjc

Communication is the issue. What we have here is a failure to communicate....how does that song go? I implemented a system whereby incoming inspection would check component packaging to the spec. If it did not match they were to contact the process e

Height paste measurement

Electronics Forum | Wed Jul 24 04:23:42 EDT 2002 | harisfaisal

Juan, I believe in term of height vs volume, volume is much better control. By the way we used Cyber Sentry 2000 which allows us to measure volume, height and area. My plant normal practice is measuring the height. Last time I did the control limit

BGA Contact

Electronics Forum | Thu Jul 25 03:01:25 EDT 2002 | martz

We experience e-test failure due to BGA problem. The product was subjected to 40 deg.C hot air blowing on the BGA area and it works pretty well. The product then failed when the temperature became 36 deg. C as the hot air blower is withdrawn. If it

Rework Equipment

Electronics Forum | Sat Jul 27 10:17:33 EDT 2002 | sam_b

Hello, I am looking into purchasing a rework system for BGA's. Contacted several manufacturers, both large and small, all seemed desperate to sell their stuff. I would need to be locked up in a nut house should I base my purchasing decision on the


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