Electronics Forum: spec (Page 171 of 186)

Re: Solder Mask IPC Standard

Electronics Forum | Sun Oct 10 17:40:50 EDT 1999 | JohnW

| | | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | | | PCB is FR4 | | | Solder Mask is LPI | | | Reflow and W/S Profile = Standard

Re: Losing parts in wave

Electronics Forum | Wed Oct 06 08:49:22 EDT 1999 | Mark

| | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Ou

Re: Losing parts in wave

Electronics Forum | Wed Oct 06 11:41:50 EDT 1999 | Bill Haynes

| | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Ou

Re: Solder Beading Solder Balling

Electronics Forum | Thu Aug 05 11:51:44 EDT 1999 | Wolfgang Busko

| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi

Re: Solder on GF

Electronics Forum | Tue Jul 13 19:00:29 EDT 1999 | JohnW

| Hi All, | Does any one experienced the solder on gold finger after | reflow. Its about 5 to 8 mils diameter . | We'd clean the entire screen printer, mounter & reflow as well, | but doesn't help much. | | Mr Kong..... Solder on gold is a age old

Re: Solder on GF

Electronics Forum | Wed Jul 14 10:58:25 EDT 1999 | Upinder Singh

| | Hi All, | | Does any one experienced the solder on gold finger after | | reflow. Its about 5 to 8 mils diameter . | | We'd clean the entire screen printer, mounter & reflow as well, | | but doesn't help much. | | | | | Mr Kong..... | | Solder

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean

| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 15:51:36 EDT 1999 | JohnW

| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Tue Jun 08 11:54:17 EDT 1999 | Steve Skinner

| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI

Re: QFP solder paste volume

Electronics Forum | Sun May 23 15:12:59 EDT 1999 | JohnW

| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor


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