Electronics Forum | Fri Feb 16 02:00:12 EST 2001 | PeteC
Dreamsniper, The optimum contact (dwell) time in the wave should be 2 seconds. Contact band width is a function of conveyor speed. For an example, 5cm of contact band width at 150cm/min. conveyor speed will give you 2 seconds of contact time and 2cm
Electronics Forum | Tue Nov 28 22:35:30 EST 2000 | rabell
We are currently in release 1.4 and 1.5 of the majority of our courses, partly because we do fix minor errors that do crop up, and release maintenance updates. I infer from your comment that you take exception to one or more of the test questions in
Electronics Forum | Mon Oct 11 15:06:39 EDT 1999 | Dave F
| | Thank you all for your replies. I guess my age in this industry is showing. This military spec. does not appear to be in existance. So, let me make my request a little more to the point: | | | | Is anyone aware of a specification specifically
Electronics Forum | Fri Sep 10 15:32:30 EDT 1999 | Earl Moon
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
Electronics Forum | Wed Sep 01 13:58:10 EDT 1999 | Dave F
| Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective w
Electronics Forum | Thu Aug 26 10:21:22 EDT 1999 | John Thorup
| | Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | | Going through datasheets wasn�t that helpfull, so does anyone know of a source for
Electronics Forum | Fri Mar 19 05:08:24 EST 1999 | Vinesh Gandhi
Hey Marc, I am not sure about the kind of process you are following. Is it Gluing+paste printing on the bottom side or just gluing on the bottom side and paste printing on the top side. The relationship which I could think of between Bottom side
Electronics Forum | Thu Nov 19 16:24:23 EST 1998 | Earl Moon
| Hello Everybody | | I am new to the electronics packaging arena, please be patient with me... I have a few questions regarding the various passivation used on the silicon dice. I would really appreciate if you guys could provide me with more info
Electronics Forum | Tue Oct 27 15:25:02 EST 1998 | Stefan W.
Hi Samson ! In order to give you more detailed information I would like to know what your component range is and how many boards you supposed to do. Panasonic and MPM are a good choice, however, Panasonic has not many P&P machines on the U.S. market,
Electronics Forum | Wed Jul 15 19:54:47 EDT 1998 | ZULFIQAR
| | | | | | Dear Colleagues: | | | I am looking for quantiative data on comparing the effects of depaneling/routing versus other forms of singulation specifically shearing, | | | I need data not opinions. | | | Thanks in advance for your help.