Electronics Forum: specification (Page 196 of 280)

Surface Tension vs Part Mass

Electronics Forum | Tue Sep 12 10:55:29 EDT 2006 | slthomas

I found this searching the archives. Unfortunately Bob doesn't seem to have an active site anymore, just references by people he works for. It's a shame, because there was a load of good stuff there. Haven't looked at Phil's site for a while but it's

How do you clean OSP PCB's without washing it off?

Electronics Forum | Thu Sep 14 20:11:19 EDT 2006 | davef

You weren't specific about the OSP that you use. We use Entek Plus CU-106A. Yes, just about everything removes Entek, especially if there's heat involved. Ethone states: * Alcohol strips 70% of the coating * Water removes 15% * Kyzen Lonox only t

Run Fuji IP-1 at 100% speed?

Electronics Forum | Fri Sep 15 15:55:27 EDT 2006 | jdengler

Bert, Hopefully the MCS still has PD's from Fuji or the previous user. The Transverse rate IP set in them should be a good guide for any new PD's you may need to make. This speed is usually set as high as possible and still get accurate placements

Quad 4c Nozzle Height Saga

Electronics Forum | Tue Oct 10 11:06:04 EDT 2006 | lheiss

Hi All, I wasn't sure how this would turn out until I ran some production. As I suspected, after every nozzle change the machine dumps the first 3 pickups, checks the nozzle height again (function 30?) and then begins placing with correction with n

Soldering Iron Questions

Electronics Forum | Thu Nov 02 15:46:43 EST 2006 | rgduval

I'm looking for some information on soldering irons being used in my no-lead process. Specifically, my floor seem to be burning out tips at an alarming rate, when soldering lead-free assemblies. Today, I had one woman burn out a brand new tip in 4

PCA shipping requirements

Electronics Forum | Tue Nov 28 08:27:05 EST 2006 | davef

Choices are: * IPC-RB-276 [superseded by IPC-6011/6012], Section 5 discusses some basic shipping and packaging requirements. Also, it references ASTM D-3951 and MIL-P-116. * Universal Instruments has done a nice job putting together a packaging speci

Ways to control SMT gap to PCB

Electronics Forum | Thu Dec 07 19:20:28 EST 2006 | ganoi

Most likely there is movement during reflow. How about conduction oven over convection oven for reflow? This is a small PCB with the LED sitting on a Flex-Rigid extension from the PCB. I was thinking if the stencil aperature for the LED was to be cu

Wave flux and profiling

Electronics Forum | Fri Dec 15 18:36:46 EST 2006 | Grant

Hi, I have noticed we are getting residue on our wave pcb's and it's worse with lead free, since we changed to the flux we are using. We are currently using Avantec VOC Free flux model Ecofree 303. It looks like it's made in Malaysia. Does anyone h

SMEMA Interface cables?

Electronics Forum | Mon Jan 15 01:13:25 EST 2007 | grantp

Hi, Does anyone know where to purchase the connectors? Specifically bulkhead connectors or PCB mount connectors. I am thinking about doing a general purpose SMEMA box that has a Basic Stamp in the core, and some buttons so I can use it for general

Tantalum influence on other components

Electronics Forum | Wed Jan 17 03:52:20 EST 2007 | Vladimir

Hi, I am process engineer of SMT production. We have some strange problemn with tantalum capacitors. 1 case: If tantalum capacitor placed near BGA and one of his legs is connected to one of the BGA balls, after reflow we can see short between two or


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