Electronics Forum | Wed Aug 20 08:05:06 EDT 2008 | pjc
They are faster today, but still not up to fixed-pin machine speeds. They tend to be 7x to 10x slower. Any of the machine suppliers can run a test evaluation and give you a report on test coverage and test times. There are techniques to make them fas
Electronics Forum | Fri Sep 05 10:31:22 EDT 2008 | realchunks
Without knowing your board, oven or profile, I would suggest working the middle of your profile. Try a slower conveyor speed to increase your soak zone of your profile. This will decrease your delta-T across the board. You may also have to work on
Electronics Forum | Tue Sep 30 09:21:08 EDT 2008 | eedlund
Anyone using a No-clean solder paste on a pcb with a 100 Mbps Ethernet chip? Will the residue cause any signal degradation? Any issues with a no-clean solder paste and 1000 Mbps Gigabit Ethernet? Device: National Semiconductor DP83848 10/100 Mb
Electronics Forum | Wed Dec 17 09:55:10 EST 2008 | jorge_quijano
Hi to everyone, I will be runnig product with adhesive with a MPM UP2K, I'll use a 0.020" stepped stencil & metal blades. Is it better to use high speed for print head travel? more/less squeegee force than with solder? slow snap off? what could you r
Electronics Forum | Tue Dec 23 15:06:25 EST 2008 | evtimov
It depends how manual is the printer. you need to control pressure and speed. If you control both by hand, it is difficult to discuss results. If the pressure is controlled by the printer, than you should be able to do it by one deposit. Also is the
Electronics Forum | Wed Dec 24 20:11:43 EST 2008 | xianhua_tang
hi,brettc! Our stencil openings no more than 4mm * 4mm, you have a larger component of the pads is more than a 4*4? At the same time, with the thickness of the stencil, I would like to increase the printing speed can be improved to reduce the thickne
Electronics Forum | Thu Apr 23 21:07:09 EDT 2009 | luismolinero
Emilio: Several factors you need to take into account and your process parameters will depend on: Solder Alloy, Is there any Fine Pitch?; BGA?; Smaller chip size?. Tipically you should go for controls in: Solder Temperature and viscosity; blade and s
Electronics Forum | Mon Nov 09 12:12:41 EST 2009 | mcmark
Same here, I've been programming Mydata placement machines using CircuitCAM since 1999, at 2 companies. With an ASCII CAD file imported and simple BOM scrubbing, we can get programs directly output to our Mydatas in less than 5 minutes. Developing as
Electronics Forum | Wed Oct 07 10:04:07 EDT 2009 | soudomphong
Thank you for responding. I called Speedline tech > support he think there is a short some where in > the motor. I changed the motor out and still have > the same problem. The chain is normal, and using > automatic lubricating. I will check more
Electronics Forum | Thu Oct 08 07:29:51 EDT 2009 | andrzej
We have 250x340mm panel of PCBs. Stencil for glue would be 0,3mm with about 80 holes mostly for chip components. Our MPM printer at standard set, prints paste on 1 panel at 40-50sec. I need general information if printing glue is faster or slower p