Electronics Forum | Tue Feb 19 14:00:55 EST 2002 | global
We have had some discussions about what causes parts to lift out of the holes when going over the wave on our flow solder machine. The machine being used is a Treiber (700 series). There are two bottom pre-heaters and one top pre-heater. We try to pr
Electronics Forum | Wed Feb 27 14:07:25 EST 2002 | Stefan
In order to kiss off the components with an air blow, there are two times to consider: 1. reaction time of the solenoid ( to shut off the vacuum and turn on the air ), 5-10 ms 2. time required to fill up an air hose, which leads to the nozzle. Assumi
Electronics Forum | Wed Mar 27 14:56:43 EST 2002 | Claude_Couture
Can american R&D cooperate with customer and industry needs? can the education system produce world class engineers? Can freedom american style even remember what cooperation and team work is? It's a dog eat dog out there and eveybody is out to prote
Electronics Forum | Fri Mar 22 09:22:44 EST 2002 | itempea
Steve, don't forget that the first assessment you should make is whether a CP6 is what you really need. It's highly reliable, fast, but no so flexible. For a low volume, high mix, it might not be your best bet. Other things to consider: - the exper
Electronics Forum | Wed Apr 03 13:32:30 EST 2002 | Bob
Hi, Just to ease your mind a little. I have 15 years experiance on Fuji kit, and was the engineer in charge of over 30 CP6's. They are very robust and the electrical / electronic side is pretty bomb proof. The main thing to look out for is wear in
Electronics Forum | Sun Apr 28 07:34:34 EDT 2002 | hany_khoga
Dear Tom : I hope I �m not too late. We produce PC motherboards with some buses exceeding the speed of 100MHz . we use no clean flux and it is OK even with the residues you can see under a microscope. But according to our own experience through a mo
Electronics Forum | Wed Apr 24 19:12:19 EDT 2002 | russ
I may be stupid but what exactly do you mean by "foil" on both sides? Are you having trouble with top flow? bridging? Are you using water soluble or noclean? Are you also waving SMT components? Anyway, normally the solder temp should be 460 - 500 F(
Electronics Forum | Thu Apr 25 04:22:14 EDT 2002 | ianchan
We have an internal debate whether to calibrate equipment using K-type thermocouple made out of : 1) fibreglass braided, with a 482 deg-C peak-measurement properties? 2) teflon FEP(fluorinated Ethylene Proplene), with 204 deg-C peak-measurement p
Electronics Forum | Mon May 27 11:57:37 EDT 2002 | arcandspark
One thing you should do is characterize your reflow oven, run profile boards of various densities, say 2 gm/sq.in. to 10 gm/sq.in. Adjust the oven settings for these various boards to acheive your standard profile based on your solder paste manufactu
Electronics Forum | Tue Jun 25 15:30:49 EDT 2002 | Steve L
Hi everyone. I am now faced with a problem on soldering PBGA. At first, I ran the board (FR4, 7" X 10" with 12 layer) at Peak Temp: 205 C and 54 seconds above 183 C. After reflow, I found several cold solder joints and one ball without second collaps