Electronics Forum | Tue Aug 31 20:41:45 EDT 1999 | Dreamsniper
| | I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average r
Electronics Forum | Thu Aug 12 22:38:44 EDT 1999 | Dave F
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
Electronics Forum | Thu Aug 05 10:40:38 EDT 1999 | John Thorup
| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usually publishe
Electronics Forum | Thu Jul 15 11:01:06 EDT 1999 | Earl Moon
| | Hello All, | | I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? | | Also anyone who is mou
Electronics Forum | Wed Jul 14 13:10:49 EDT 1999 | Earl Moon
| I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it
Electronics Forum | Wed Jul 14 13:22:51 EDT 1999 | kt
| I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it
Electronics Forum | Thu Jul 15 10:33:59 EDT 1999 | Michael Zadrejko
| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run
Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Fri Jul 02 16:16:53 EDT 1999 | Scotty
| | I am currently looking into ways to decrease SMT changeover times. I work in a high mix-low volume factory. We use Fuji CP's and IP's for SMT production. I would appreciate hearing from anybody that has some proven methods for reducing setup/chan
Electronics Forum | Sat Jul 03 19:24:25 EDT 1999 | JohnW
50% reduction in time. One draw back, the availability of feeders... You need 280 feeders max to change over a max capacity of 140 feeder machine (or a variance of a product mix vs. part numbers); then there's 8mm, 12mm, 16mm, sticks feeders that c
